From manure-to-energy RNG to an aluminum-air system that generates electricity on demand, innovators tackled real AI bottlenecks—power-chain integration, rapid fiber turn-ups, AI-driven permitting, and plug-and-play capacity that speeds time-to-value.
AMD improved energy efficiency 38x—roughly a 97% drop in energy for the same compute—and now targets 20x rack-scale gains by 2030, reimagining AI training, inference, and data-center design.
Exploring how Flex is rethinking data center power and cooling – from 97.5% efficient power shelves to liquid cooling and “grid to chip” solutions – with Chris Butler, President of Embedded & Critical Power.
Vanguard lead data engineer and IEEE senior member Vivek Venkatesan shares how a pivotal Botswana project shaped his path, how trust turns innovation into impact , and much more.
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
From Wi-Fi to AI, Mark Grodzinsky shares how chance turns, mentors, and market inflection points shaped his career – and why true innovation is about impact, not hype.
Our flagship podcast earned a Stevie® in the International Business Awards® annual competition; judges called out the show’s high production quality, editorial clarity, and guest caliber.
FMS 2025 celebrated Jim Pappas’ lifetime of standards leadership while showcasing how AI is reshaping memory and storage with record-breaking innovation across the industry.
A unified security-first platform is eliminating decades of fragmented IT vulnerabilities while delivering military-grade protection at half the cost
Hypertec’s immersion-born servers cut cooling power by 50% and shrink 10MW deployments from 100,000 sq ft to around 10,000—showing liquid cooling isn’t experimental anymore; it’s essential.
Matty Bakkeren checks in on how data center trends are playing out in 2025, from nations pouring billions into AI supremacy projects to how data centers are trying to offset massive energy needs.
New integration delivers enterprise-grade backup, disaster recovery, and cyber resilience for virtualized and container-based workloads across Platform9’s Private Cloud Director.
TechArena host Allyson Klein chats with Open Compute Project VP of Emerging Markets, Steve Helvie, about the proceedings in Lisbon this week and how OCP is helping to shape the cutting edge of infrastructure innovation.
TechArena host Allyson Klein chats with ZeroPoint Technologies’ VP of Business Development Nilesh Shah about the AI era demands for memory innovation, how advanced chiplet architectures will assist semiconductor teams in advancing memory access for balanced system delivery, and how ZeroPoint Technologies plans to play a strategic role in this major market transition.
TechArena host Allyson Klein chats with HPE’s Jean-Marie Verdun about his organization’s groundbreaking work to redefine firmware management using OpenBMC technology and how this breakthrough addresses data center customer demands.
TechArena host Allyson Klein chats with CircleB’s Matty Bakkeren about how his organization is leveraging OCP specifications to deliver innovative and sustainable solutions to data center customers, how AI is re-shaping operator requirements, and how he sees the market shaping in 2024.
TechArena hosts Allyson Klein and Jeniece Wronowski chat with CoreWeave’s Jacob Yundt about how his organization is delivering a scalable data pipeline to AI customers utilizing breakthrough VAST Data solutions featuring Solidigm QLC SSDs.
The TechArena kicks off a Data Insights Series in collaboration with Solidigm, and TechArena host welcomes co-host Jeniece Wronowski and Solidigm data center marketing director Ace Stryker to the program to talk about data in the AI era, the series objectives, and how SSD innovation sits at the foundation of a new data pipeline.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.