
The 2025 OCP Global Summit brings together the most forward-thinking minds in open hardware and software development. Held at the San Jose McEnery Convention Center, this four-day in-person event features keynote presentations, breakout sessions, the Innovation Village expo, co-located workshops, and networking receptions. Attendees will collaborate on community-driven standards, explore future technologies, and connect with leaders driving the AI-powered data center revolution.
Two new genAI tests (Llama 3.1 8B, Flux.1) align with production stacks as multi-node results climb. NVIDIA posts many fastest times; University of Florida, Wiwynn, and Datacrunch expand the ecosystem.
Allyson Klein talks with author and Google/Intel alum Wanjiku Kamau on moving past AI skepticism, learning fast, and using new tools with intention—so readers start where they are and explore AI with hope.
Billions of customer interactions during peak seasons expose critical network bottlenecks, which is why critical infrastructure decisions must happen before you write a single line of code.
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
At the OCP Global Summit, Avayla CEO Kelley Mullick reveals how rapid standardization and hybrid cooling strategies are reshaping infrastructure for the AI era.
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Durgesh Srivastava unpacks a data-loop approach that powers reliable edge inference, captures anomalies, and encodes technician know-how so robots weld, inspect, and recover like seasoned operators.
From CPU orchestration to scaling efficiency in networks, leaders reveal how to assess your use case, leverage existing infrastructure, and productize AI instead of just experimenting.
Ventiva discusses how hard-won laptop cooling know-how can unlock inside-the-box gains for AI servers and racks—stabilizing hotspots, preserving acoustics, and boosting performance.
From the OCP Global Summit, hear why 50% GPU utilization is a “civilization-level” problem, and why open standards are key to unlocking underutilized compute capacity.
Design shifted to rack-scale. Power and cooling span the full path. Liquid is table stakes. Three takeaways from OCP 2025—and why CelLink’s PowerPlane fits an AI-factory mindset.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.
From OCP Summit San Jose, Allyson Klein and co-host Jeniece Wnorowski interview Dr. Andrew Chien (UChicago & Argonne) on grid interconnects, rack-scale standards, and how openness speeds innovation.
From OCP Summit, Metrum AI CEO Steen Graham unpacks multi-agent infrastructure, SSD-accelerated RAG, and the memory-to-storage shift—plus a 2026 roadmap to boost GPU utilization, uptime, and time-to-value.
From the OCP Global Summit in San Jose, Allyson Klein sits down with Chris Butler of Flex to unpack how the company is collapsing the gap between IT and power—literally and figuratively.
From OCP Summit 2025, Kelley Mullick joins Allyson Klein and co-host Jeniece Wnorowski for a Data Insights episode on rack-scale design, hybrid cooling (incl. immersion heat recapture), and open standards.
At OCP’s 2025 global summit, Momenthesis founder Matty Bakkeren joins Allyson Klein to explore why open standards and interoperability are vital to sustaining AI innovation at datacenter scale.
Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.
AMI CEO Sanjoy Maity joins In the Arena to unpack the company's shift to open source firmware, OCP contributions, OpenBMC hardening, and the rack-scale future—cooling, power, telemetry, and RAS built for AI.
Appointment to Open Compute Project Foundation board of directors, contribution of Foundation Chiplet System Architecture (FCSA) spec underscore Arm’s ascendency in hyperscale, AI data centers.
Graid Technology takes on Intel VROC licensing for data center and workstation customers, extending its RAID portfolio to offer both CPU-integrated and GPU-accelerated solutions.
CelLink’s ultrathin flex harnessing ushers in a new era in compute infrastructure innovation, cutting cable volume by up to 90% and boosting density, reliability, and efficiency.
From data center to edge, Arm is enabling full-stack AI efficiency, powering ecosystems with performance-per-watt optimization, tailored silicon, and software portability across environments.
Real-Time Energy Routing (RER) treats electricity like data—modular, dynamic, and software-defined—offering a scalable path to resilient, sustainable data center power.
AMD improved energy efficiency 38x—roughly a 97% drop in energy for the same compute—and now targets 20x rack-scale gains by 2030, reimagining AI training, inference, and data-center design.
Exploring how Flex is rethinking data center power and cooling – from 97.5% efficient power shelves to liquid cooling and “grid to chip” solutions – with Chris Butler, President of Embedded & Critical Power.
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
SC25 convenes thousands of researchers, engineers, and industry experts at America’s Center in downtown St. Louis. The week-long program includes keynote addresses, peer-reviewed technical paper sessions, hands-on tutorials, workshops, and the SCinet networking infrastructure project. An extensive exhibition floor, the Students@SC volunteer program, and dedicated networking receptions make SC25 the must-attend forum for the global HPC community.
AWS re:Invent 2025 is a global cloud computing conference, uniting developers, engineers, and business leaders across multiple Las Vegas venues. Over five days, attendees can engage with visionary keynotes, choose from 2,000+ technical sessions covering infrastructure, AI/ML, security, and DevOps, and participate in hands-on labs and certification prep. The expansive Expo Hall showcases the latest AWS services and partner solutions, while networking receptions and community-driven events foster connections with peers and AWS experts. Whether you’re accelerating your cloud journey, mastering new skills, or exploring generative AI, re:Invent equips you with strategies to innovate and scale