Data Center
Highlights
MicroCloud + AMD EPYC™ 4004 = High-Density Win for CSPs
Supermicro’s new MicroCloud platform, powered by AMD EPYC™ 4004 CPUs, delivers higher core density, network flexibility, and TCO advantages for cloud service providers at scale.
ASBIS Tackles Regional IT Challenges with Smart Solutions
From Western Europe to the Middle East, ASBIS is solving infrastructure challenges with scalable solutions, regional expertise, and strategic partnerships like Solidigm.
CloudFest 2025: Honing the Human Edge
At the intersection of cutting-edge tech and human empathy, CloudFest 2025 explored how AI, sustainability, and service-centric design are reshaping the future of data centers and digital infrastructure.
Why Small Chiplets are a BIG Deal
Chiplets are transforming processor design, enabling greater performance, efficiency, and scalability. Matty Bakkeren’s latest blog explores how chiplets are reshaping the future of computing.
Fortinet: Active Security for a Rapidly Evolving Threat Landscape
With cybercrime costs soaring to $10.5T by 2030, IT leaders need smarter security. Fortinet’s AI-powered solutions enhance threat detection, automate response, and protect cloud environments at scale.
Catchpoint’s Powerful Approach to Internet Monitoring and Security
In our continuing Cloud Field Day coverage, explore Catchpoint’s approach to proactive internet monitoring and how its IPM platform enhances user experience, brand protection, and revenue growth.
Flex Demonstrates Leadership with Acquisition of JetCool
Flex strengthens its direct liquid cooling portfolio with its acquisition of JetCool, adding their MIT-developed tech to Flex’s broad offerings across power, cooling and data center infrastructure.
JetCool Tackles AI’s Power Demands with Precision Cooling
JetCool's innovative liquid cooling targets hotspots directly, supporting AI's growing power needs while enhancing sustainability through efficient heat reuse and scalable solutions for data centers.
CoolIT: Leading the Pack on Liquid Cooling
CoolIT Systems is driving efficiency and performance for AI in data centers with cutting-edge liquid cooling solutions.
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
Arm advances data center tech with power-efficient CPUs, modular chiplet designs, and the scalable Neoverse platform, supporting hyperscalers and AI workloads with sustainable, adaptive solutions.
Boo! TechArena's Spookiest Tech Trends Heading to 2025
This Halloween, TechArena explores 2025’s top spooky tech trends: zombie data haunting storage, AI hallucinations leading to false data, and cyborg advances redefining humanity!
3 Top Takeaways from OCP Summit
The 2024 OCP Summit spotlighted performance, power, and standards in the AI era, delivering record attendance and more than one jaw-dropping announcement. Check out our top takeaways from the event.
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Podcasts
Connectivity for the AI Era with Alphawave Semi’s Tony Chan Carusone
TechArena host Allyson Klein chats with Alphawave Semi’s CTO Tony Chan Carusone regarding the unique opportunity for connectivity innovation to fuel the era of AI and why Alphawave is perfectly poised for IP, chiplet and custom solution delivery.
Exploring the Birth of the Universe with the NASA Webb Telescope
TechArena host Allyson Klein sits down with NASA’s Matt Greenhouse to discuss the Webb telescope project, a mission he has been working on for decades, and how it will shape our understanding of the birth of the universe, exoplanets, and potentially life beyond Earth.
Scalable, Open-Source Authorization with Cerbos
TechArena host Allyson Klein talks with Cerbos co-founder and CEO Emre Baran of the importance of authorization solutions and why he founded Cerbos to deliver scalable code that developers can seamlessly integrate into cloud native applications.
Disruptive Security Advancement with VectorZero
TechArena host Allyson Klein chats with VectorZero CTO and co-founder Sean Grimaldi about his extensive experience fighting bad actors to protect the nation’s security and how his learning at the CIA has informed his approach to elimination of attack vectors at VectorZero.
Observability in the Era of Distributed Computing with cPacket Networks
TechArena host Allyson Klein chats with cPacket Networks CTO Ron Nevo about how observability has evolved for a multi-cloud to edge era and why his company is delivering four key components of observability solutions to customers.
Phoenix Rising: The Future of CPU Innovation with AMD
TechArena host Allyson Klein chats with AMD's Lynn Comp about the changing landscape of CPU design and how AMD is poised to lead future innovation.
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Driving Sustainable Data Center Infrastructure for the Next Wave of Greenfield Buildout with Jon Summers
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
Disruptive Chiplet Innovation Delivers the Next Wave of Data Center Performance with Palo Alto Electron’s Jawad Nasrullah
TechArena host Allyson Klein chats with Palo Alto Electron CEO Jawad Nasrullah about his vision for an open chiplet economy, the semiconductor manufacturing hurdles standing in the way of broad chiplet market delivery, and how he plans to play a role in shaping this next evolution of the semiconductor landscape.
