Data Center
Highlights
Data Center Industry Veteran Lynn Comp Shares 3 Patterns Observed Over 30 Years in Tech
Data center industry veteran Lynn Comp shares insights from her career, discussing the importance of adaptability, emotional IQ, and practical tech. She highlights three patterns: customers prefer reliability over high-performance solutions, network limitations can negate compute power, and economic realities can override technological enthusiasm.
Dog Days of Summer – Looking forward to OCP Summit
The upcoming OCP Summit in October will feature nineteen top-tier sponsors, up from just three in previous years, highlighting OCP’s role in AI infrastructure innovation. TechArena is excited to be a media sponsor, covering sustainable infrastructure, Sonic’s future, memory advancements, and power and cooling solutions with daily podcasts, video interviews, and stories.
It’s Gettin’ Hot in Here: Industry veteran Jim Fister unpacks the history of the data center
In this blog post, industry veteran Jim Fister explores the evolution of data centers from early 2000s servers to modern AI/ML racks. Highlighting engineering and logistical challenges, he emphasizes the need for ongoing innovation and celebrates engineers while anticipating future advancements to meet increasing power demands.
The State of Open Compute Infrastructure Innovation
TechArena spoke to over a dozen industry experts from OVH, Qarnot, PLVision, ZeroPoint Technologies, the Research Institutes of Sweden, London South Bank University, and the Open Compute Project to publish this comprehensive report on the state of open compute infrastructure innovation and how organizations should align data center planning and oversight with sustainability and performance objectives. If you manage an IT organization or oversee data center infrastructure, software, or sustainability initiatives, this report offers practical value for your organization.
Microsoft and AMD Extend AI Collaboration at Build
TechArena’s take on Microsoft Build announcement of the world’s first MI300X instances arriving on Azure AI.
Supermicro Leverages Its Heritage of Innovation to Fuel AI Era Compute
TechArena’s take on a recent Data Insights conversation featuring Supermicro and Solidigm on how Supermicro’s solutions are targeting AI data pipeline requirements and the role SSDs play in delivering high performance, efficiency and density for Supermicro solutions.
ASBIS Tackles Regional IT Challenges with Smart Solutions
From Western Europe to the Middle East, ASBIS is solving infrastructure challenges with scalable solutions, regional expertise, and strategic partnerships like Solidigm.
CloudFest 2025: Honing the Human Edge
At the intersection of cutting-edge tech and human empathy, CloudFest 2025 explored how AI, sustainability, and service-centric design are reshaping the future of data centers and digital infrastructure.
Why Small Chiplets are a BIG Deal
Chiplets are transforming processor design, enabling greater performance, efficiency, and scalability. Matty Bakkeren’s latest blog explores how chiplets are reshaping the future of computing.
Fortinet: Active Security for a Rapidly Evolving Threat Landscape
With cybercrime costs soaring to $10.5T by 2030, IT leaders need smarter security. Fortinet’s AI-powered solutions enhance threat detection, automate response, and protect cloud environments at scale.
Catchpoint’s Powerful Approach to Internet Monitoring and Security
In our continuing Cloud Field Day coverage, explore Catchpoint’s approach to proactive internet monitoring and how its IPM platform enhances user experience, brand protection, and revenue growth.
Infoblox Heralds a New Era for DDI
In this Cloud Field Day blog, Allyson Klein covers Infoblox’s unified DDI platform, tackling multi-cloud complexity, security risks, and IP conflicts for seamless management and enterprise protection.
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Podcasts
Connectivity for the AI Era with Alphawave Semi’s Tony Chan Carusone
TechArena host Allyson Klein chats with Alphawave Semi’s CTO Tony Chan Carusone regarding the unique opportunity for connectivity innovation to fuel the era of AI and why Alphawave is perfectly poised for IP, chiplet and custom solution delivery.
Exploring the Birth of the Universe with the NASA Webb Telescope
TechArena host Allyson Klein sits down with NASA’s Matt Greenhouse to discuss the Webb telescope project, a mission he has been working on for decades, and how it will shape our understanding of the birth of the universe, exoplanets, and potentially life beyond Earth.
Scalable, Open-Source Authorization with Cerbos
TechArena host Allyson Klein talks with Cerbos co-founder and CEO Emre Baran of the importance of authorization solutions and why he founded Cerbos to deliver scalable code that developers can seamlessly integrate into cloud native applications.
Disruptive Security Advancement with VectorZero
TechArena host Allyson Klein chats with VectorZero CTO and co-founder Sean Grimaldi about his extensive experience fighting bad actors to protect the nation’s security and how his learning at the CIA has informed his approach to elimination of attack vectors at VectorZero.
Observability in the Era of Distributed Computing with cPacket Networks
TechArena host Allyson Klein chats with cPacket Networks CTO Ron Nevo about how observability has evolved for a multi-cloud to edge era and why his company is delivering four key components of observability solutions to customers.
Phoenix Rising: The Future of CPU Innovation with AMD
TechArena host Allyson Klein chats with AMD's Lynn Comp about the changing landscape of CPU design and how AMD is poised to lead future innovation.
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Driving Sustainable Data Center Infrastructure for the Next Wave of Greenfield Buildout with Jon Summers
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
Disruptive Chiplet Innovation Delivers the Next Wave of Data Center Performance with Palo Alto Electron’s Jawad Nasrullah
TechArena host Allyson Klein chats with Palo Alto Electron CEO Jawad Nasrullah about his vision for an open chiplet economy, the semiconductor manufacturing hurdles standing in the way of broad chiplet market delivery, and how he plans to play a role in shaping this next evolution of the semiconductor landscape.
