Traditional data protection becomes the bottleneck when GPU idle time costs millions. Joint testing with Solidigm shows how next-generation solutions maintain full speed during drive failures.
From provisioning to observability to protection, HPE’s expanding cloud software suite targets the repatriation wave.
LLMs have given attackers new angles. Fortinet showed, step by step, how AI-driven probes escalate—and how FortiGate, FortiWeb, FortiAnalyzer, and FortiSOAR close the door without slowing the business.
From racks and liquid loops to data placement and standards pace, five takeaways from CoreWeave, Dell, NVIDIA, Solidigm, and VAST Data on building AI factories that keep accelerators busy and dollars well-spent.
At Cloud Field Day 24, Oxide outlines a vertically integrated rack—custom hypervisor, integrated power/network, and open integrations—aimed at bringing hyperscale efficiency and faster deploys to enterprise DCs.
Presenting at Cloud Field Day 24, Pure pitched fleet-level automation across mixed environments as the antidote to storage silos, promising one control plane for legacy systems and modern workloads.
Quantum breakthroughs from Microsoft, Quantinuum, and Google signal accelerating progress—but are we nearing a tipping point or still deep in the hype cycle?
OVHcloud’s infrastructure strategy includes value chain integration, water-cooled data centers and servers with high-performance storage capabilities, setting it apart in the cloud industry.
From breakthrough 122TB SSDs to the industry’s first liquid-cooled storage, Solidigm’s Avi Shetty unpacks how storage is powering AI workloads from hyperscale to neo-cloud.
From GPU and storage servers to turnkey rack-scale solutions, Giga Computing showcases its expanding OCP portfolio and the evolution of Giga PODs for high-density, high-efficiency data centers.
Open Compute EMEA Summit featured announcements of major rack and power architecture innovations that address AI-driven data center challenges with advanced cooling and engineering solutions.
With EDA flows, broad IP, & EMIB-T support ready for Intel 18A/18A-P, Synopsys helps designers tackle high performance chip design.
TechArena host Allyson Klein chats with Open Compute Project VP of Emerging Markets, Steve Helvie, about the proceedings in Lisbon this week and how OCP is helping to shape the cutting edge of infrastructure innovation.
TechArena host Allyson Klein chats with ZeroPoint Technologies’ VP of Business Development Nilesh Shah about the AI era demands for memory innovation, how advanced chiplet architectures will assist semiconductor teams in advancing memory access for balanced system delivery, and how ZeroPoint Technologies plans to play a strategic role in this major market transition.
TechArena host Allyson Klein chats with HPE’s Jean-Marie Verdun about his organization’s groundbreaking work to redefine firmware management using OpenBMC technology and how this breakthrough addresses data center customer demands.
TechArena host Allyson Klein chats with CircleB’s Matty Bakkeren about how his organization is leveraging OCP specifications to deliver innovative and sustainable solutions to data center customers, how AI is re-shaping operator requirements, and how he sees the market shaping in 2024.
TechArena hosts Allyson Klein and Jeniece Wronowski chat with CoreWeave’s Jacob Yundt about how his organization is delivering a scalable data pipeline to AI customers utilizing breakthrough VAST Data solutions featuring Solidigm QLC SSDs.
The TechArena kicks off a Data Insights Series in collaboration with Solidigm, and TechArena host welcomes co-host Jeniece Wronowski and Solidigm data center marketing director Ace Stryker to the program to talk about data in the AI era, the series objectives, and how SSD innovation sits at the foundation of a new data pipeline.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.