Data Center
articles
Xinnor Reinvents RAID for the Era of AI-Driven Data Centers
Traditional data protection becomes the bottleneck when GPU idle time costs millions. Joint testing with Solidigm shows how next-generation solutions maintain full speed during drive failures.
CFD24: HPE Bets on a “Cool-Again” Private Cloud Strategy
From provisioning to observability to protection, HPE’s expanding cloud software suite targets the repatriation wave.
When AI is a Bad Actor's Best Friend: Fortinet at CFD24
LLMs have given attackers new angles. Fortinet showed, step by step, how AI-driven probes escalate—and how FortiGate, FortiWeb, FortiAnalyzer, and FortiSOAR close the door without slowing the business.
5 Ways To Keep GPUs Fed—Hard-Won Lessons From Our AI Factory Panel
From racks and liquid loops to data placement and standards pace, five takeaways from CoreWeave, Dell, NVIDIA, Solidigm, and VAST Data on building AI factories that keep accelerators busy and dollars well-spent.
CFD24: Oxide Delivers Couture Hyperscale Infra for the Enterprise
At Cloud Field Day 24, Oxide outlines a vertically integrated rack—custom hypervisor, integrated power/network, and open integrations—aimed at bringing hyperscale efficiency and faster deploys to enterprise DCs.
Pure Storage Offers Prompt-Based Control, Smooth Infra Management
Presenting at Cloud Field Day 24, Pure pitched fleet-level automation across mixed environments as the antidote to storage silos, promising one control plane for legacy systems and modern workloads.
Inside Yotta’s Innovate Arena: Standout Breakthroughs for AI
From manure-to-energy RNG to an aluminum-air system that generates electricity on demand, innovators tackled real AI bottlenecks—power-chain integration, rapid fiber turn-ups, AI-driven permitting, and plug-and-play capacity that speeds time-to-value.
AMD’s 38x Efficiency Leap Sets Stage for Ambitious 2030 Goal
AMD improved energy efficiency 38x—roughly a 97% drop in energy for the same compute—and now targets 20x rack-scale gains by 2030, reimagining AI training, inference, and data-center design.
5 Fast Facts on Compute Efficiency with Flex’s Chris Butler
Exploring how Flex is rethinking data center power and cooling – from 97.5% efficient power shelves to liquid cooling and “grid to chip” solutions – with Chris Butler, President of Embedded & Critical Power.
Innovation with Empathy: A Q&A with Vivek Venkatesan
Vanguard lead data engineer and IEEE senior member Vivek Venkatesan shares how a pivotal Botswana project shaped his path, how trust turns innovation into impact , and much more.
CoolIT: 5 Fast Facts on Compute Efficiency
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
Mark Grodzinsky on Building Ecosystems That Last
From Wi-Fi to AI, Mark Grodzinsky shares how chance turns, mentors, and market inflection points shaped his career – and why true innovation is about impact, not hype.
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Podcasts
Protecting Against Quantum Cybersecurity Threats with Winbond
In this In the Arena episode, Winbond’s Jun Kawaguchi discusses their industry-leading strategies for tackling next-gen cybersecurity threats, ensuring robust protection for the future.
PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
Bill Gropp on the NCSA and the Future of Supercomputing Innovation
In this podcast, NCSA Director Bill Gropp explores the latest advanced computing trends, from AI innovations to groundbreaking research on supercomputing climate models, and how this tech is transforming science and society.
Revolutionizing AI Workloads with Advanced Data Center Solutions
Discover how AI is transforming data centers, with innovations in high-speed networking, emulation, and hyperscale infrastructure driving efficiency and performance in the era of AI workloads.
OCP Summit Recap: Innovation, Collaboration & Future Focus
OCP’s Rob Coyle shares insights on AI, cooling innovations, and open hardware’s role in transforming data centers as the industry accelerates toward scalable, sustainable infrastructure.
AI’s Impact on OCP: Scaling Innovation and Infrastructure Growth
In this episode, OCP CEO George Tchaparian shares how OCP is driving AI infrastructure innovation, fostering collaboration, and tackling scalability, efficiency, and sustainability challenges in data centers and beyond.
How Flex Manages Power, Heat and Scale in the AI Era: Part 1
Rob Campbell of Flex discusses how Flex is driving data center transformation with cutting-edge solutions like liquid cooling, AI-ready infrastructure, and vertical integration for global hyperscalers.
CircleB: Optimizing Data Centers for AI Workloads
Tune in as Jason Maselino of Circle B discusses the role of Open Compute Project in revolutionizing data centers with energy-efficient solutions, modular designs, and AI-ready infrastructure.
Scaling Innovation: How MIPS Balances Performance with Flexibility in a Data-Driven World
MIPS CTO Durgesh Srivastava shares insights on AI, data centers, automotive edge, and how MIPS is leveraging RISC-V to drive efficient, flexible computing solutions.
Powering AI with ZincFive’s Sustainable Battery Solutions
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Revolutionizing RAID: Graid's Supreme Solution for Modern Data Challenges
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
