Data Center
articles
OCP 2025: Open is the Only Way We Scale the AI Data Center
Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.
Arm Joins OCP Board, Contributes Chiplet Architecture Spec
Appointment to Open Compute Project Foundation board of directors, contribution of Foundation Chiplet System Architecture (FCSA) spec underscore Arm’s ascendency in hyperscale, AI data centers.
CelLink Flex Harnesses Enable the AI Power Revolution
CelLink’s ultrathin flex harnessing ushers in a new era in compute infrastructure innovation, cutting cable volume by up to 90% and boosting density, reliability, and efficiency.
Giving Storage Strategy a Reboot for Efficiency with Solidigm
As AI workloads push storage power consumption higher, the path to true storage efficiency demands systems-level thinking including hardware, software, and better metrics for picking the right drives.
Cirrascale CEO on Defining Compute Efficiency
Dave Driggers, CEO of Cirrascale, breaks down what “compute efficiency” really means, from GPU utilization and TCO modeling to token-based pricing that drives predictable customer value.
5 Fast Facts: Arm’s Role in Shaping AI Infrastructure
From data center to edge, Arm is enabling full-stack AI efficiency, powering ecosystems with performance-per-watt optimization, tailored silicon, and software portability across environments.
MicroCloud + AMD EPYC™ 4004 = High-Density Win for CSPs
Supermicro’s new MicroCloud platform, powered by AMD EPYC™ 4004 CPUs, delivers higher core density, network flexibility, and TCO advantages for cloud service providers at scale.
ASBIS Tackles Regional IT Challenges with Smart Solutions
From Western Europe to the Middle East, ASBIS is solving infrastructure challenges with scalable solutions, regional expertise, and strategic partnerships like Solidigm.
CloudFest 2025: Honing the Human Edge
At the intersection of cutting-edge tech and human empathy, CloudFest 2025 explored how AI, sustainability, and service-centric design are reshaping the future of data centers and digital infrastructure.
Why Small Chiplets are a BIG Deal
Chiplets are transforming processor design, enabling greater performance, efficiency, and scalability. Matty Bakkeren’s latest blog explores how chiplets are reshaping the future of computing.
Fortinet: Active Security for a Rapidly Evolving Threat Landscape
With cybercrime costs soaring to $10.5T by 2030, IT leaders need smarter security. Fortinet’s AI-powered solutions enhance threat detection, automate response, and protect cloud environments at scale.
Catchpoint’s Powerful Approach to Internet Monitoring and Security
In our continuing Cloud Field Day coverage, explore Catchpoint’s approach to proactive internet monitoring and how its IPM platform enhances user experience, brand protection, and revenue growth.
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Podcasts
Giga Computing on Rack-Scale AI: From Training to Inference
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
RackRenew & Circularity: Remanufacture, Recertify, Redeploy
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
From OCP 2025: Arm’s Chiplet Push and the AI Ecosystem Play
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
PEAK:AIO on Smarter Storage for AI—Data Insights @ OCP
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Giga Computing on Rack-Scale AI: From Training to Inference
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
RackRenew & Circularity: Remanufacture, Recertify, Redeploy
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
From OCP 2025: Arm’s Chiplet Push and the AI Ecosystem Play
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
PEAK:AIO on Smarter Storage for AI—Data Insights @ OCP
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
