Data Center
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Dog Days of Summer – Looking forward to OCP Summit
The upcoming OCP Summit in October will feature nineteen top-tier sponsors, up from just three in previous years, highlighting OCP’s role in AI infrastructure innovation. TechArena is excited to be a media sponsor, covering sustainable infrastructure, Sonic’s future, memory advancements, and power and cooling solutions with daily podcasts, video interviews, and stories.
It’s Gettin’ Hot in Here: Industry veteran Jim Fister unpacks the history of the data center
In this blog post, industry veteran Jim Fister explores the evolution of data centers from early 2000s servers to modern AI/ML racks. Highlighting engineering and logistical challenges, he emphasizes the need for ongoing innovation and celebrates engineers while anticipating future advancements to meet increasing power demands.
The State of Open Compute Infrastructure Innovation
TechArena spoke to over a dozen industry experts from OVH, Qarnot, PLVision, ZeroPoint Technologies, the Research Institutes of Sweden, London South Bank University, and the Open Compute Project to publish this comprehensive report on the state of open compute infrastructure innovation and how organizations should align data center planning and oversight with sustainability and performance objectives. If you manage an IT organization or oversee data center infrastructure, software, or sustainability initiatives, this report offers practical value for your organization.
Microsoft and AMD Extend AI Collaboration at Build
TechArena’s take on Microsoft Build announcement of the world’s first MI300X instances arriving on Azure AI.
Supermicro Leverages Its Heritage of Innovation to Fuel AI Era Compute
TechArena’s take on a recent Data Insights conversation featuring Supermicro and Solidigm on how Supermicro’s solutions are targeting AI data pipeline requirements and the role SSDs play in delivering high performance, efficiency and density for Supermicro solutions.
A Revolution of Open Infrastructure in Lisbon at OCP Regional Summit
We kick off this week’s reporting from Open Compute Project’s Regional Summit in Lisbon with some thoughts on historic innovation and how it shapes society.
Exploring the Latest in IO Chiplets with Alphawave Semi
In this video from Chiplet Summit, learn about Alphawave Semi’s new AlphaCHIP1600-IO, an industry-first multi-protocol IO chiplet supporting PCIe Gen 6, CXL 3.1, and 800G Ethernet.
Security for the Quantum Age with Winbond
As quantum computing advances, Winbond is pioneering post-quantum cryptography to safeguard data against emerging threats. Learn how they’re preparing for the quantum security revolution.
Arm Defines a New Standard for Chiplet Interoperability
In this video, learn why Arm is investing in chiplets as a way to build dynamic options for compute in the AI era, and hear more about their new Chiplet Standard Architecture Specification.
Tale of a Trained Phishing Target
With Data Privacy Week around the corner, Cyber Innovator Sean Grimaldi breaks down how phishing tactics exploit trust and human error. Learn strategies to defend against this evolving threat.
TechArena 2025 Predictions Report
In this report, discover the 2025 predictions of TechArena’s Voices of Innovation – industry experts who forecasting what’s on the horizon in AI, data centers, edge, network, sustainability and more.
1011 Fact-Based Guesses for 2025
Interested in what’s on the horizon for tech in 2025? Jim Fister’s latest article delves into the future of work, the emergence of AI-as-a-service, global innovation and several more geeky insights for the year ahead.
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Podcasts
From OCP 2025: Arm’s Chiplet Push and the AI Ecosystem Play
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
PEAK:AIO on Smarter Storage for AI—Data Insights @ OCP
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
CelLink PowerPlane: Flat Power for AI Server Racks
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Hybrid Quantum + HPC: CESQ’s Lesya Dymyd at OCP 2025
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
How Flex Manages Power, Heat and Scale in the AI Era: Part 2
Join us as Rob Campbell from Flex discusses the challenges and innovations in data centers, focusing on power, heat, and scale, while shaping the future of AI and sustainable solutions.
How Flex Manages Power, Heat and Scale in the AI Era: Part 1
Rob Campbell of Flex discusses how Flex is driving data center transformation with cutting-edge solutions like liquid cooling, AI-ready infrastructure, and vertical integration for global hyperscalers.
CircleB: Optimizing Data Centers for AI Workloads
Tune in as Jason Maselino of Circle B discusses the role of Open Compute Project in revolutionizing data centers with energy-efficient solutions, modular designs, and AI-ready infrastructure.
Scaling Innovation: How MIPS Balances Performance with Flexibility in a Data-Driven World
MIPS CTO Durgesh Srivastava shares insights on AI, data centers, automotive edge, and how MIPS is leveraging RISC-V to drive efficient, flexible computing solutions.
Powering AI with ZincFive’s Sustainable Battery Solutions
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Revolutionizing RAID: Graid's Supreme Solution for Modern Data Challenges
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
