Data Center
articles
Exploring the Latest in IO Chiplets with Alphawave Semi
In this video from Chiplet Summit, learn about Alphawave Semi’s new AlphaCHIP1600-IO, an industry-first multi-protocol IO chiplet supporting PCIe Gen 6, CXL 3.1, and 800G Ethernet.
Security for the Quantum Age with Winbond
As quantum computing advances, Winbond is pioneering post-quantum cryptography to safeguard data against emerging threats. Learn how they’re preparing for the quantum security revolution.
Arm Defines a New Standard for Chiplet Interoperability
In this video, learn why Arm is investing in chiplets as a way to build dynamic options for compute in the AI era, and hear more about their new Chiplet Standard Architecture Specification.
Tale of a Trained Phishing Target
With Data Privacy Week around the corner, Cyber Innovator Sean Grimaldi breaks down how phishing tactics exploit trust and human error. Learn strategies to defend against this evolving threat.
TechArena 2025 Predictions Report
In this report, discover the 2025 predictions of TechArena’s Voices of Innovation – industry experts who forecasting what’s on the horizon in AI, data centers, edge, network, sustainability and more.
1011 Fact-Based Guesses for 2025
Interested in what’s on the horizon for tech in 2025? Jim Fister’s latest article delves into the future of work, the emergence of AI-as-a-service, global innovation and several more geeky insights for the year ahead.
Inside Yotta’s Innovate Arena: Standout Breakthroughs for AI
From manure-to-energy RNG to an aluminum-air system that generates electricity on demand, innovators tackled real AI bottlenecks—power-chain integration, rapid fiber turn-ups, AI-driven permitting, and plug-and-play capacity that speeds time-to-value.
AMD’s 38x Efficiency Leap Sets Stage for Ambitious 2030 Goal
AMD improved energy efficiency 38x—roughly a 97% drop in energy for the same compute—and now targets 20x rack-scale gains by 2030, reimagining AI training, inference, and data-center design.
5 Fast Facts on Compute Efficiency with Flex’s Chris Butler
Exploring how Flex is rethinking data center power and cooling – from 97.5% efficient power shelves to liquid cooling and “grid to chip” solutions – with Chris Butler, President of Embedded & Critical Power.
Innovation with Empathy: A Q&A with Vivek Venkatesan
Vanguard lead data engineer and IEEE senior member Vivek Venkatesan shares how a pivotal Botswana project shaped his path, how trust turns innovation into impact , and much more.
CoolIT: 5 Fast Facts on Compute Efficiency
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
Mark Grodzinsky on Building Ecosystems That Last
From Wi-Fi to AI, Mark Grodzinsky shares how chance turns, mentors, and market inflection points shaped his career – and why true innovation is about impact, not hype.
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Podcasts
Couture Silicon for the Cloud
TechArena host Allyson Klein talks with Ampere Chief Product Officer Jeff Wittich on rise of Ampere fueled computing in the cloud and why Ampere's lineup places it in an excellent position for the next wave of cloud growth.
Universal Storage Disruption - Vast Data Podcast
Allyson chats with Vast Data co-founder and CMO Jeff Denworth about Universal Storage and why it aims to disrupt traditional data paradigms.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
PEAK:AIO on Smarter Storage for AI—Data Insights @ OCP
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
CelLink PowerPlane: Flat Power for AI Server Racks
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Hybrid Quantum + HPC: CESQ’s Lesya Dymyd at OCP 2025
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
Ventiva Brings Innovative Solid-State Cooling to the AI Data Center
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.
