Interested in what’s on the horizon for tech in 2025? Jim Fister’s latest article delves into the future of work, the emergence of AI-as-a-service, global innovation and several more geeky insights for the year ahead.
Discover how Gigabyte expanded beyond gaming hardware to become a leader in data center innovation, AI infrastructure, advanced cooling solutions and open compute standards.
In this blog, Momenthesis’ Matty Bakkeren explores how AI integration, OCP growth, and data centers as energy assets will reshape the future of data infrastructure in 2025 and beyond.
AMD’s Ravi Kuppuswamy discusses energy efficiency, open standards, and the evolution of computing in the AI era.
In this blog, data center expert Vernon Turner explores how data centers stay cool while addressing their high environmental costs, highlighting innovative cooling methods and renewable energy solutions.
In this video from SC24, experts discuss how the world’s largest SSD will transform their AI and HPC workloads, enabling faster access and accelerating growth while reducing data center footprints.
JetCool's innovative liquid cooling targets hotspots directly, supporting AI's growing power needs while enhancing sustainability through efficient heat reuse and scalable solutions for data centers.
CoolIT Systems is driving efficiency and performance for AI in data centers with cutting-edge liquid cooling solutions.
Arm advances data center tech with power-efficient CPUs, modular chiplet designs, and the scalable Neoverse platform, supporting hyperscalers and AI workloads with sustainable, adaptive solutions.
This Halloween, TechArena explores 2025’s top spooky tech trends: zombie data haunting storage, AI hallucinations leading to false data, and cyborg advances redefining humanity!
The 2024 OCP Summit spotlighted performance, power, and standards in the AI era, delivering record attendance and more than one jaw-dropping announcement. Check out our top takeaways from the event.
Keysight’s AI Data Center Test Platform enhances AI network infrastructure by emulating workloads, benchmarking performance, and optimizing AI cluster communication for high-throughput, low-latency environments.
Learn how CoolIT Systems is driving efficiency and performance in AI and data centers with cutting-edge liquid cooling solutions in our latest Data Insights podcast.
In this episode, Rebecca Weekly shares how GEICO is rethinking cloud strategy and embracing OCP for improved efficiency, security, and cost savings in its infrastructure journey.
Join Allyson Klein and Jeniece Wnorowski as they chat with Eddie Ramirez from Arm about how chiplet innovations and compute efficiency are driving AI and transforming data center architecture.
In this episode – recorded live at the OCP Summit – host Allyson Klein catches up with Intel Corporate VP Zane Ball to discuss silicon innovation, AI evolution, and the future of enterprise adoption.
Join us as Rob Campbell from Flex discusses the challenges and innovations in data centers, focusing on power, heat, and scale, while shaping the future of AI and sustainable solutions.
Rob Campbell of Flex discusses how Flex is driving data center transformation with cutting-edge solutions like liquid cooling, AI-ready infrastructure, and vertical integration for global hyperscalers.
Tune in as Jason Maselino of Circle B discusses the role of Open Compute Project in revolutionizing data centers with energy-efficient solutions, modular designs, and AI-ready infrastructure.
MIPS CTO Durgesh Srivastava shares insights on AI, data centers, automotive edge, and how MIPS is leveraging RISC-V to drive efficient, flexible computing solutions.
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.