Data Center
Highlights
articles
Cloud Field Day Report: WEKA Throws the Data Gauntlet
TechArena’s quick take on WEKA’s discussion from Cloud Field Day.
One More Time with Feeling - the Ultra Ethernet OCP Collaboration
TechArena’s take on the Ultra Ethernet Consortium Open Compute Project collaboration announcement and what it means for AI clusters.
The Connectivity Broker for the AI Era: AlphaWave Semi
TechArena’s take on the importance of connectivity to AI and how Alphawave Semi is poised to deliver the perfect portfolio for solution activation.
The Future of VMware: Going Down the Rabbit Hole at VMware Explore 2023
Allyson Klein goes down the rabbit hole of Broadcom’s pending acquisition of VMWare and posits that NSX may be the jewel of the VMWare portfolio.
The Future of Silicon Innovation in the Chiplet Era
TechArena’s take on Alphawave Semi and how Letizia Guiliano and her team are poised to win in the chiplet era
MemCon and the Path Forward with Memory in a Post Moore’s Law World
TechArena’s take on the path to memory innovation from MemCon
Universal Storage Disruption with Vast Data
Have you ever heard of Universal Storage? It’s a new class of storage management which is challenging the standard storage pyramid driven by a disruptive force of a company called Vast Data.
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Podcasts
Data Insights Series Sponsored by Solidigm: Achieving AI Scale with CoreWeave
TechArena hosts Allyson Klein and Jeniece Wronowski chat with CoreWeave’s Jacob Yundt about how his organization is delivering a scalable data pipeline to AI customers utilizing breakthrough VAST Data solutions featuring Solidigm QLC SSDs.
Exploring Data in the AI Era with Solidigm - New Data Insights Series
The TechArena kicks off a Data Insights Series in collaboration with Solidigm, and TechArena host welcomes co-host Jeniece Wronowski and Solidigm data center marketing director Ace Stryker to the program to talk about data in the AI era, the series objectives, and how SSD innovation sits at the foundation of a new data pipeline.
Charting Architectural Innovation in the Chiplet Era with OCP's Cliff Grossner
TechArena host Allyson Klein chats with OCP’s Cliff Grossner regarding the chiplet era, how architectural evolution has evolved to a chiplet economy, and how the OCP is helping create an open marketplace for innovation.
Building Composable Data Systems with Voltron Data CEO Josh Patterson
TechArena host Allyson Klein chats with Voltron Data CEO Josh Patterson about delivery of Theseus, a composable data system framework that unleashes develops with new interoperability and flexibility for AI era data challenges.
Ampere Advances in the Data Center with Jeff Wittich
TechArena host Allyson Klein chats with Ampere Chief Product Officer Jeff Wittich about his company’s progress in winning data center deployments, advances in performance and sustainability, and pushing the limits on core density.
Security in the AI Era with Fortinet’s Srija Allam and Julian Petersohn
TechArena host Allyson Klein chats with Fortinet security experts Srija Allam and Julian Petersohn about the expansive Fortinet solution portfolio and how the company is leaning into AI to help deliver the protection customers require.
Revolutionizing RAID: Graid's Supreme Solution for Modern Data Challenges
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Accelerating European Data Center Buildout with OCP’s Raul Alvarez
TechArena host Allyson Klein chats with OCP’s Raul Alvarez on his new charter accelerating growth of the data center market in Europe as well as his ongoing work in immersion cooling technologies from OCP Lisbon 2024.
