A Trio of Trackable Topics at OCP Summit
The OCP Summit kicked off last night with its customary opening reception. This event is the highlight of the year in how hyperscale infrastructure is advancing, and this week's Summit is rumored to be the largest in history.
The elephant walking the halls of the San Jose Convention Center is how infrastructure will adapt to the continued pressure of AI performance demands, and whether open hardware design pivots to a world where performance density and acceleration are the keys to the kingdom. The TechArena is delighted to once again be a media sponsor of the event, and we'll be delivering key takeaways from the show all week. Here are the top things we're targeting for the biggest news at the event:
Performance: How will OCP pivot its focus to address the world of accelerated computing? This is on top of many people's minds at the show that has been dominated by CPU-centric designs for over a decade. This year's Summit is different, with NVIDIA taking a much more visible role in the proceedings and NVIDIA having delivered reference designs to OCP for construction of rack-level AI compute. We'll be tracking how much NVIDIA technology is being embedded into OCP workstreams within our conversations with both members of the foundation and industry representatives.
Power and Cooling: With emphasis on expansion of data centers and delivery of more watts per square foot, the power and cooling industry will be out en masse at this week's Summit. Last year, Submer made waves, literally, with an immersion cooling tank system that got everyone's attention. This same tank was featured in yesterday's podcast with CircleB. However, the discussion on direct-to-chip and immersion cooling approaches continues to bubble, and we expect to hear a lot from the industry on cooling advancements, collaborations like the one announced by Flex on our podcast today, and discussions of dielectric alternatives sending chem geeks into molecular bliss.
Standards: Last year's Summit featured a major announcement about Ultra Ethernet, and AMD made waves yesterday with the introduction of the first Ultra Ethernet adapter to hit the market. We've seen standards advancements in scale up networking, chiplet designs and expect to hear more about memory advancements at the conference. We'll be covering all announcements from the show through interviews with standards leaders assembled in San Jose.
Are these the topics you're seeking from OCP Summit? Follow along by following us on LinkedIn, subscribing to our feed or connecting with us to provide feedback on what you want to hear about most.
The OCP Summit kicked off last night with its customary opening reception. This event is the highlight of the year in how hyperscale infrastructure is advancing, and this week's Summit is rumored to be the largest in history.
The elephant walking the halls of the San Jose Convention Center is how infrastructure will adapt to the continued pressure of AI performance demands, and whether open hardware design pivots to a world where performance density and acceleration are the keys to the kingdom. The TechArena is delighted to once again be a media sponsor of the event, and we'll be delivering key takeaways from the show all week. Here are the top things we're targeting for the biggest news at the event:
Performance: How will OCP pivot its focus to address the world of accelerated computing? This is on top of many people's minds at the show that has been dominated by CPU-centric designs for over a decade. This year's Summit is different, with NVIDIA taking a much more visible role in the proceedings and NVIDIA having delivered reference designs to OCP for construction of rack-level AI compute. We'll be tracking how much NVIDIA technology is being embedded into OCP workstreams within our conversations with both members of the foundation and industry representatives.
Power and Cooling: With emphasis on expansion of data centers and delivery of more watts per square foot, the power and cooling industry will be out en masse at this week's Summit. Last year, Submer made waves, literally, with an immersion cooling tank system that got everyone's attention. This same tank was featured in yesterday's podcast with CircleB. However, the discussion on direct-to-chip and immersion cooling approaches continues to bubble, and we expect to hear a lot from the industry on cooling advancements, collaborations like the one announced by Flex on our podcast today, and discussions of dielectric alternatives sending chem geeks into molecular bliss.
Standards: Last year's Summit featured a major announcement about Ultra Ethernet, and AMD made waves yesterday with the introduction of the first Ultra Ethernet adapter to hit the market. We've seen standards advancements in scale up networking, chiplet designs and expect to hear more about memory advancements at the conference. We'll be covering all announcements from the show through interviews with standards leaders assembled in San Jose.
Are these the topics you're seeking from OCP Summit? Follow along by following us on LinkedIn, subscribing to our feed or connecting with us to provide feedback on what you want to hear about most.
