Data Center
articles
Quantum Momentum: Nearing a Tipping Point or Just Growing Hype?
Quantum breakthroughs from Microsoft, Quantinuum, and Google signal accelerating progress—but are we nearing a tipping point or still deep in the hype cycle?
OVHcloud Innovates Cloud Infrastructure with AI, Sustainable Tech
OVHcloud’s infrastructure strategy includes value chain integration, water-cooled data centers and servers with high-performance storage capabilities, setting it apart in the cloud industry.
Solidigm Spotlights AI Storage and Liquid Cooling at OCP
From breakthrough 122TB SSDs to the industry’s first liquid-cooled storage, Solidigm’s Avi Shetty unpacks how storage is powering AI workloads from hyperscale to neo-cloud.
Giga Computing Scales OCP Innovation with Giga PODs
From GPU and storage servers to turnkey rack-scale solutions, Giga Computing showcases its expanding OCP portfolio and the evolution of Giga PODs for high-density, high-efficiency data centers.
OCP EMEA Summit Highlights: The Race to 1MW IT Loads per Rack
Open Compute EMEA Summit featured announcements of major rack and power architecture innovations that address AI-driven data center challenges with advanced cooling and engineering solutions.
Synopsys, Intel Foundry Team Up to Spur Angstrom-Scale Innovation
With EDA flows, broad IP, & EMIB-T support ready for Intel 18A/18A-P, Synopsys helps designers tackle high performance chip design.
The TechArena Cloud 2023
TechArena Cloud 2023 delivers seven strategies for maximizing organizational return based on industry expert perspectives.
The super-sized future is here with AMD’s Instinct MI300
TechArena’s take on AMD’s recent reveal of their Instinct MI300 expected in market later this year and the inflection point towards super-sized chiplet designs.
Oh What a Fine Mess We’ve Made: The State of Cloud Automation
Thoughts on the state of cloud stack management and automation with the rise of cloud management complexity.
Cloud Computing at a quarter century
As we reach the 25th anniversary of cloud computing we set off to see what technology innovations will shape the next wave of cloud computing adoption.
The Future of SuperComputing: Unlocking Access
A recap of SC’22 with a focus on silicon, platform, and scientific innovation highlights.
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Podcasts
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Driving Sustainable Data Center Infrastructure for the Next Wave of Greenfield Buildout with Jon Summers
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
Disruptive Chiplet Innovation Delivers the Next Wave of Data Center Performance with Palo Alto Electron’s Jawad Nasrullah
TechArena host Allyson Klein chats with Palo Alto Electron CEO Jawad Nasrullah about his vision for an open chiplet economy, the semiconductor manufacturing hurdles standing in the way of broad chiplet market delivery, and how he plans to play a role in shaping this next evolution of the semiconductor landscape.
From OCP 2025: Arm’s Chiplet Push and the AI Ecosystem Play
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
PEAK:AIO on Smarter Storage for AI—Data Insights @ OCP
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
CelLink PowerPlane: Flat Power for AI Server Racks
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Hybrid Quantum + HPC: CESQ’s Lesya Dymyd at OCP 2025
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
