Vanguard lead data engineer and IEEE senior member Vivek Venkatesan shares how a pivotal Botswana project shaped his path, how trust turns innovation into impact , and much more.
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
From Wi-Fi to AI, Mark Grodzinsky shares how chance turns, mentors, and market inflection points shaped his career – and why true innovation is about impact, not hype.
The new EcoStruxure™ Pod accelerates data center readiness, reducing complexity, cost, and risk while boosting sustainability and AI workload support.
From anti–money-laundering analytics to leading identity protection, Tannu Jiwnani shares how curiosity, resilience, and inclusive leadership shape responsible innovation and why diversity is security’s superpower.
Experts from across the compute industry provide their bold views and real-world expertise on AI era computing is driving business and societal opportunity.
In our continuing Cloud Field Day coverage, explore Catchpoint’s approach to proactive internet monitoring and how its IPM platform enhances user experience, brand protection, and revenue growth.
In this Cloud Field Day blog, Allyson Klein covers Infoblox’s unified DDI platform, tackling multi-cloud complexity, security risks, and IP conflicts for seamless management and enterprise protection.
As a delegate at Cloud Field Day 22, our own Allyson Klein kicks off her coverage of the event by discussing the top trends she’s following this week in Silicon Valley. Stay tuned!
In this video from Chiplet Summit, learn about Alphawave Semi’s new AlphaCHIP1600-IO, an industry-first multi-protocol IO chiplet supporting PCIe Gen 6, CXL 3.1, and 800G Ethernet.
As quantum computing advances, Winbond is pioneering post-quantum cryptography to safeguard data against emerging threats. Learn how they’re preparing for the quantum security revolution.
In this video, learn why Arm is investing in chiplets as a way to build dynamic options for compute in the AI era, and hear more about their new Chiplet Standard Architecture Specification.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.