With a dual-track AI strategy and commitment to renewable energy, European cloud provider Scaleway is reshaping hyperscale trends with focused innovation and environmental responsibility.
As global regulators close in on Google's dominance in search and ad tech, parallels emerge with past enforcement actions against other tech behemoths. Is history repeating itself in Silicon Valley?
Supermicro’s new MicroCloud platform, powered by AMD EPYC™ 4004 CPUs, delivers higher core density, network flexibility, and TCO advantages for cloud service providers at scale.
From Western Europe to the Middle East, ASBIS is solving infrastructure challenges with scalable solutions, regional expertise, and strategic partnerships like Solidigm.
At the intersection of cutting-edge tech and human empathy, CloudFest 2025 explored how AI, sustainability, and service-centric design are reshaping the future of data centers and digital infrastructure.
Chiplets are transforming processor design, enabling greater performance, efficiency, and scalability. Matty Bakkeren’s latest blog explores how chiplets are reshaping the future of computing.
As part of Flex, JetCool is scaling its microconvective cooling technology to help hyperscalers deploy next-gen systems faster, streamlining cooling deployments from server to rack in the AI era.
Ventiva discusses how hard-won laptop cooling know-how can unlock inside-the-box gains for AI servers and racks—stabilizing hotspots, preserving acoustics, and boosting performance.
At GTC DC, NVIDIA outlined DOE-scale AI systems, debuted NVQLink to couple GPUs and quantum, partnered with Nokia on AI-RAN to 6G, mapped Uber robotaxis for 2027, and highlighted Synopsys’ GPU gains.
Design shifted to rack-scale. Power and cooling span the full path. Liquid is table stakes. Three takeaways from OCP 2025—and why CelLink’s PowerPlane fits an AI-factory mindset.
Traditional data protection becomes the bottleneck when GPU idle time costs millions. Joint testing with Solidigm shows how next-generation solutions maintain full speed during drive failures.
From provisioning to observability to protection, HPE’s expanding cloud software suite targets the repatriation wave.
TechArena host Allyson Klein chats with OCP’s Raul Alvarez on his new charter accelerating growth of the data center market in Europe as well as his ongoing work in immersion cooling technologies from OCP Lisbon 2024.
TechArena host Allyson Klein and Solidigm’s Jeniece Wnorowski chat with Weka’s Joel Kaufman, as he tours the Weka data platform and how the company’s innovation provides sustainable data management that scales for the AI era.
TechArena host Allyson Klein chats with PLVision Director of Open Networking Solutions and Strategy, Taras Chornyi, about the progress of SONIC and open network infrastructure for the AI Era.
TechArena host Allyson Klein is joined by Solidigm’s Jeniece Wnorowski as they continue to explore rapid data innovation fueling today’s computing. In today’s episode, they chat with VAST Data’s Global VP of Engineering, Subramanian Kartik, as he describes how his team has delivered a breakthrough data platform for the AI Era.
TechArena host Allyson Klein chat’s with OCP’s Lesya Dymyd about her work steering the organization’s future technologies symposium as well as her deep collaboration with European technology providers and operators delivering to the region’s unique market requirements.
TechArena host Allyson Klein chats with Qarnot CEO Paul Benoit about how VC backed startups are an essential element of vibrant industry innovation, and how the AI era has placed requirements on innovative approaches to sustainable IT.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.