Data Center
articles
AI Is Squeezing Storage Supply—and VAST Wants Your Flash
AI demand is tightening HDD and NAND supply—and prices may follow. VAST is betting on flash reclamation and KV-cache persistence as storage starts acting more like memory.
RackRenew Turns Decommissioned OCP Hardware into Ready Capacity
RackRenew remanufactures OCP compliant-infrastructure into certified, warranty-backed assemblies—standardized, tested, and ready to deploy for faster capacity without bespoke engineering.
5 Data Infrastructure Shifts That Will Define Enterprise AI in 2026
These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
OCP 2025: Arm’s Chiplet Play Aims To Democratize AI Compute
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Achieving HPC Performance with Xeon 6 Processors
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
Open-Source AI and the Road to Broad Deployment
Open models move fast—but production doesn’t forgive surprises. Lynn Comp maps how to pair open-source AI with a solid CPU foundation and orchestration to scale from pilot to platform.
It’s Gettin’ Hot in Here: Industry veteran Jim Fister unpacks the history of the data center
In this blog post, industry veteran Jim Fister explores the evolution of data centers from early 2000s servers to modern AI/ML racks. Highlighting engineering and logistical challenges, he emphasizes the need for ongoing innovation and celebrates engineers while anticipating future advancements to meet increasing power demands.
The State of Open Compute Infrastructure Innovation
TechArena spoke to over a dozen industry experts from OVH, Qarnot, PLVision, ZeroPoint Technologies, the Research Institutes of Sweden, London South Bank University, and the Open Compute Project to publish this comprehensive report on the state of open compute infrastructure innovation and how organizations should align data center planning and oversight with sustainability and performance objectives. If you manage an IT organization or oversee data center infrastructure, software, or sustainability initiatives, this report offers practical value for your organization.
Microsoft and AMD Extend AI Collaboration at Build
TechArena’s take on Microsoft Build announcement of the world’s first MI300X instances arriving on Azure AI.
Supermicro Leverages Its Heritage of Innovation to Fuel AI Era Compute
TechArena’s take on a recent Data Insights conversation featuring Supermicro and Solidigm on how Supermicro’s solutions are targeting AI data pipeline requirements and the role SSDs play in delivering high performance, efficiency and density for Supermicro solutions.
A Revolution of Open Infrastructure in Lisbon at OCP Regional Summit
We kick off this week’s reporting from Open Compute Project’s Regional Summit in Lisbon with some thoughts on historic innovation and how it shapes society.
Delivering AI Performance at Scale with CoreWeave
The TechArena’s reflection on the disruptive innovation that CoreWeave is driving into the AI service arena fueled by Solidigm QLC NAND and VAST Data platform innovation.
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Podcasts
RackRenew & Circularity: Remanufacture, Recertify, Redeploy
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
Hybrid Quantum + HPC: CESQ’s Lesya Dymyd at OCP 2025
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
OCP, Power Grids & Open Racks — with Dr. Andrew Chien
From OCP Summit San Jose, Allyson Klein and co-host Jeniece Wnorowski interview Dr. Andrew Chien (UChicago & Argonne) on grid interconnects, rack-scale standards, and how openness speeds innovation.
Ventiva Reinvents Cooling with Silent Airflow Tech
Ventiva CEO Carl Schlachte joins Allyson Klein to share how the company’s Ionic Cooling Engine is transforming laptops, servers, and beyond with silent, modular airflow.
