Interested in what’s on the horizon for tech in 2025? Jim Fister’s latest article delves into the future of work, the emergence of AI-as-a-service, global innovation and several more geeky insights for the year ahead.
Discover how Gigabyte expanded beyond gaming hardware to become a leader in data center innovation, AI infrastructure, advanced cooling solutions and open compute standards.
In this blog, Momenthesis’ Matty Bakkeren explores how AI integration, OCP growth, and data centers as energy assets will reshape the future of data infrastructure in 2025 and beyond.
AMD’s Ravi Kuppuswamy discusses energy efficiency, open standards, and the evolution of computing in the AI era.
In this blog, data center expert Vernon Turner explores how data centers stay cool while addressing their high environmental costs, highlighting innovative cooling methods and renewable energy solutions.
In this video from SC24, experts discuss how the world’s largest SSD will transform their AI and HPC workloads, enabling faster access and accelerating growth while reducing data center footprints.
Interested in what’s on the horizon for tech in 2025? Jim Fister’s latest article delves into the future of work, the emergence of AI-as-a-service, global innovation and several more geeky insights for the year ahead.
Discover how Gigabyte expanded beyond gaming hardware to become a leader in data center innovation, AI infrastructure, advanced cooling solutions and open compute standards.
In this blog, Momenthesis’ Matty Bakkeren explores how AI integration, OCP growth, and data centers as energy assets will reshape the future of data infrastructure in 2025 and beyond.
AMD’s Ravi Kuppuswamy discusses energy efficiency, open standards, and the evolution of computing in the AI era.
In this blog, data center expert Vernon Turner explores how data centers stay cool while addressing their high environmental costs, highlighting innovative cooling methods and renewable energy solutions.
In this video from SC24, experts discuss how the world’s largest SSD will transform their AI and HPC workloads, enabling faster access and accelerating growth while reducing data center footprints.
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
In this podcast, NCSA Director Bill Gropp explores the latest advanced computing trends, from AI innovations to groundbreaking research on supercomputing climate models, and how this tech is transforming science and society.
Discover how AI is transforming data centers, with innovations in high-speed networking, emulation, and hyperscale infrastructure driving efficiency and performance in the era of AI workloads.
OCP’s Rob Coyle shares insights on AI, cooling innovations, and open hardware’s role in transforming data centers as the industry accelerates toward scalable, sustainable infrastructure.
In this episode, OCP CEO George Tchaparian shares how OCP is driving AI infrastructure innovation, fostering collaboration, and tackling scalability, efficiency, and sustainability challenges in data centers and beyond.
JetCool Founder & CEO Bernie Malouin discusses the company’s breakthrough liquid cooling tech, which targets processor hotspots with jets of coolant to boost efficiency across intensive workloads.
Tune in as Jason Maselino of Circle B discusses the role of Open Compute Project in revolutionizing data centers with energy-efficient solutions, modular designs, and AI-ready infrastructure.
MIPS CTO Durgesh Srivastava shares insights on AI, data centers, automotive edge, and how MIPS is leveraging RISC-V to drive efficient, flexible computing solutions.
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.