Data Center
Highlights
A Revolution of Open Infrastructure in Lisbon at OCP Regional Summit
We kick off this week’s reporting from Open Compute Project’s Regional Summit in Lisbon with some thoughts on historic innovation and how it shapes society.
Delivering AI Performance at Scale with CoreWeave
The TechArena’s reflection on the disruptive innovation that CoreWeave is driving into the AI service arena fueled by Solidigm QLC NAND and VAST Data platform innovation.
VAST Data Soars with Industry Heavyweights
VAST Data reveals more of their AI strategy with collaboration announcements with NVIDIA and Supermicro.
VAST Data Upends Storage in the AI Era
TechArena’s take on VAST Data from AI Field Day and how TechArena readers can expect to hear a lot more from the company in the months ahead.
Arm Targets an Ecosystem for Growing Data Center Deployments
Arm is making headway in delivering an architecture alternative to the data center. Read TechArena’s take on their progress from technology enabling to building a true ecosystem for the workload requirements for the next decade.
AMD Leaps Ahead with Zen Architecture Powered EYPC Processors for the Cloud
TechArena’s Cloud Field Day report on AMD’s strategy for cloud native computing.
1011 Fact-Based Guesses for 2025
Interested in what’s on the horizon for tech in 2025? Jim Fister’s latest article delves into the future of work, the emergence of AI-as-a-service, global innovation and several more geeky insights for the year ahead.
Gigabyte: From Gaming Gear to Open Compute Trailblazer
Discover how Gigabyte expanded beyond gaming hardware to become a leader in data center innovation, AI infrastructure, advanced cooling solutions and open compute standards.
Matty Bakkeren: 3 Trends That Could Transform Data Centers in 2025
In this blog, Momenthesis’ Matty Bakkeren explores how AI integration, OCP growth, and data centers as energy assets will reshape the future of data infrastructure in 2025 and beyond.
Redefining Data Centers: AMD’s Take on AI and Compute Evolution
AMD’s Ravi Kuppuswamy discusses energy efficiency, open standards, and the evolution of computing in the AI era.
Being Cool May Not Be Sustainable
In this blog, data center expert Vernon Turner explores how data centers stay cool while addressing their high environmental costs, highlighting innovative cooling methods and renewable energy solutions.
Revolutionizing Data Storage: Harnessing 122TB SSDs for AI & HPC
In this video from SC24, experts discuss how the world’s largest SSD will transform their AI and HPC workloads, enabling faster access and accelerating growth while reducing data center footprints.
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Podcasts
Universal Storage Disruption - Vast Data Podcast
Allyson chats with Vast Data co-founder and CMO Jeff Denworth about Universal Storage and why it aims to disrupt traditional data paradigms.
CircleB: Optimizing Data Centers for AI Workloads
Tune in as Jason Maselino of Circle B discusses the role of Open Compute Project in revolutionizing data centers with energy-efficient solutions, modular designs, and AI-ready infrastructure.
Scaling Innovation: How MIPS Balances Performance with Flexibility in a Data-Driven World
MIPS CTO Durgesh Srivastava shares insights on AI, data centers, automotive edge, and how MIPS is leveraging RISC-V to drive efficient, flexible computing solutions.
Powering AI with ZincFive’s Sustainable Battery Solutions
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Revolutionizing RAID: Graid's Supreme Solution for Modern Data Challenges
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
