Data Center
Highlights
A Revolution of Open Infrastructure in Lisbon at OCP Regional Summit
We kick off this week’s reporting from Open Compute Project’s Regional Summit in Lisbon with some thoughts on historic innovation and how it shapes society.
Delivering AI Performance at Scale with CoreWeave
The TechArena’s reflection on the disruptive innovation that CoreWeave is driving into the AI service arena fueled by Solidigm QLC NAND and VAST Data platform innovation.
VAST Data Soars with Industry Heavyweights
VAST Data reveals more of their AI strategy with collaboration announcements with NVIDIA and Supermicro.
VAST Data Upends Storage in the AI Era
TechArena’s take on VAST Data from AI Field Day and how TechArena readers can expect to hear a lot more from the company in the months ahead.
Arm Targets an Ecosystem for Growing Data Center Deployments
Arm is making headway in delivering an architecture alternative to the data center. Read TechArena’s take on their progress from technology enabling to building a true ecosystem for the workload requirements for the next decade.
AMD Leaps Ahead with Zen Architecture Powered EYPC Processors for the Cloud
TechArena’s Cloud Field Day report on AMD’s strategy for cloud native computing.
OPEN Innovation to Face Off Data Center Challenges
Why Companies Should Apply the Power of OPEN Innovation to Data Center Infrastructure
3 Exec Insights on Cultivating Successful Industry Partnerships
Tech industry vet Lynn Comp explores the benefits of industry partnerships and why it’s critical to understand one’s own business drivers and their partner’s to achieve success.
Iceotope Delivers Great Chemistry for Cool Data Centers
Iceotope's liquid cooling tech is shaking up data centers as AI drives the need for efficient heat management. Dr. Kelley Mullick explains the shift from air to liquid cooling, highlighting Iceotope's sustainable solutions.
It’s No Coincidence that Wait-and-See Rhymes with Latency
Jim Fister dives deep into the intricacies of system memory, latency, and data management, exploring how modern computing architectures handle data retrieval and processing.
Advanced Packaging: Driving the AI Era Forward
AI is driving an acceleration of compute demands fueled by the proliferation of large language models across industry use cases. This requirement comes as traditional semiconductor technology pushes against the laws of physics with the slowing of Moore’s Law.
Contextual AI and WEKA Partner for Enterprise Class AI Activation
This week, Contextual AI partnered with WEKA to deliver enterprise AI services on Google Cloud using RAG 2.0 from Facebook AI Research. WEKA's platform boosted performance, achieving a 3X increase in key AI use cases, 4X faster model checkpointing, and reduced costs.
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Podcasts
CircleB: Optimizing Data Centers for AI Workloads
Tune in as Jason Maselino of Circle B discusses the role of Open Compute Project in revolutionizing data centers with energy-efficient solutions, modular designs, and AI-ready infrastructure.
Scaling Innovation: How MIPS Balances Performance with Flexibility in a Data-Driven World
MIPS CTO Durgesh Srivastava shares insights on AI, data centers, automotive edge, and how MIPS is leveraging RISC-V to drive efficient, flexible computing solutions.
Powering AI with ZincFive’s Sustainable Battery Solutions
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Revolutionizing RAID: Graid's Supreme Solution for Modern Data Challenges
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
Bill Gropp on the NCSA and the Future of Supercomputing Innovation
In this podcast, NCSA Director Bill Gropp explores the latest advanced computing trends, from AI innovations to groundbreaking research on supercomputing climate models, and how this tech is transforming science and society.
Revolutionizing AI Workloads with Advanced Data Center Solutions
Discover how AI is transforming data centers, with innovations in high-speed networking, emulation, and hyperscale infrastructure driving efficiency and performance in the era of AI workloads.
OCP Summit Recap: Innovation, Collaboration & Future Focus
OCP’s Rob Coyle shares insights on AI, cooling innovations, and open hardware’s role in transforming data centers as the industry accelerates toward scalable, sustainable infrastructure.
AI’s Impact on OCP: Scaling Innovation and Infrastructure Growth
In this episode, OCP CEO George Tchaparian shares how OCP is driving AI infrastructure innovation, fostering collaboration, and tackling scalability, efficiency, and sustainability challenges in data centers and beyond.
JetCool's Innovative Liquid Cooling Tech Powers High-Performance AI
JetCool Founder & CEO Bernie Malouin discusses the company’s breakthrough liquid cooling tech, which targets processor hotspots with jets of coolant to boost efficiency across intensive workloads.
