Data Center
Highlights
Flex Demonstrates Leadership with Acquisition of JetCool
Flex strengthens its direct liquid cooling portfolio with its acquisition of JetCool, adding their MIT-developed tech to Flex’s broad offerings across power, cooling and data center infrastructure.
JetCool Tackles AI’s Power Demands with Precision Cooling
JetCool's innovative liquid cooling targets hotspots directly, supporting AI's growing power needs while enhancing sustainability through efficient heat reuse and scalable solutions for data centers.
CoolIT: Leading the Pack on Liquid Cooling
CoolIT Systems is driving efficiency and performance for AI in data centers with cutting-edge liquid cooling solutions.
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
Arm advances data center tech with power-efficient CPUs, modular chiplet designs, and the scalable Neoverse platform, supporting hyperscalers and AI workloads with sustainable, adaptive solutions.
Boo! TechArena's Spookiest Tech Trends Heading to 2025
This Halloween, TechArena explores 2025’s top spooky tech trends: zombie data haunting storage, AI hallucinations leading to false data, and cyborg advances redefining humanity!
3 Top Takeaways from OCP Summit
The 2024 OCP Summit spotlighted performance, power, and standards in the AI era, delivering record attendance and more than one jaw-dropping announcement. Check out our top takeaways from the event.
Infoblox Heralds a New Era for DDI
In this Cloud Field Day blog, Allyson Klein covers Infoblox’s unified DDI platform, tackling multi-cloud complexity, security risks, and IP conflicts for seamless management and enterprise protection.
Top Trends I'm Tracking at Cloud Field Day 22
As a delegate at Cloud Field Day 22, our own Allyson Klein kicks off her coverage of the event by discussing the top trends she’s following this week in Silicon Valley. Stay tuned!
Exploring the Latest in IO Chiplets with Alphawave Semi
In this video from Chiplet Summit, learn about Alphawave Semi’s new AlphaCHIP1600-IO, an industry-first multi-protocol IO chiplet supporting PCIe Gen 6, CXL 3.1, and 800G Ethernet.
Security for the Quantum Age with Winbond
As quantum computing advances, Winbond is pioneering post-quantum cryptography to safeguard data against emerging threats. Learn how they’re preparing for the quantum security revolution.
Arm Defines a New Standard for Chiplet Interoperability
In this video, learn why Arm is investing in chiplets as a way to build dynamic options for compute in the AI era, and hear more about their new Chiplet Standard Architecture Specification.
Tale of a Trained Phishing Target
With Data Privacy Week around the corner, Cyber Innovator Sean Grimaldi breaks down how phishing tactics exploit trust and human error. Learn strategies to defend against this evolving threat.
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Podcasts
Flexibility at the Edge: Pragmatic Semiconductor’s Bold Approach
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
Protecting Against Quantum Cybersecurity Threats with Winbond
In this In the Arena episode, Winbond’s Jun Kawaguchi discusses their industry-leading strategies for tackling next-gen cybersecurity threats, ensuring robust protection for the future.
PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
Bill Gropp on the NCSA and the Future of Supercomputing Innovation
In this podcast, NCSA Director Bill Gropp explores the latest advanced computing trends, from AI innovations to groundbreaking research on supercomputing climate models, and how this tech is transforming science and society.
Revolutionizing AI Workloads with Advanced Data Center Solutions
Discover how AI is transforming data centers, with innovations in high-speed networking, emulation, and hyperscale infrastructure driving efficiency and performance in the era of AI workloads.
OCP Summit Recap: Innovation, Collaboration & Future Focus
OCP’s Rob Coyle shares insights on AI, cooling innovations, and open hardware’s role in transforming data centers as the industry accelerates toward scalable, sustainable infrastructure.
How Flex Manages Power, Heat and Scale in the AI Era: Part 2
Join us as Rob Campbell from Flex discusses the challenges and innovations in data centers, focusing on power, heat, and scale, while shaping the future of AI and sustainable solutions.
How Flex Manages Power, Heat and Scale in the AI Era: Part 1
Rob Campbell of Flex discusses how Flex is driving data center transformation with cutting-edge solutions like liquid cooling, AI-ready infrastructure, and vertical integration for global hyperscalers.
CircleB: Optimizing Data Centers for AI Workloads
Tune in as Jason Maselino of Circle B discusses the role of Open Compute Project in revolutionizing data centers with energy-efficient solutions, modular designs, and AI-ready infrastructure.
Scaling Innovation: How MIPS Balances Performance with Flexibility in a Data-Driven World
MIPS CTO Durgesh Srivastava shares insights on AI, data centers, automotive edge, and how MIPS is leveraging RISC-V to drive efficient, flexible computing solutions.
Powering AI with ZincFive’s Sustainable Battery Solutions
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Revolutionizing RAID: Graid's Supreme Solution for Modern Data Challenges
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
