Data Center
Highlights
How Security Tech has Evolved to Make Us Safer (or not) Since 9/11
In this blog, industry veteran Jim Fister reflects on the impact of technology, redundancy, and human bias on global security, especially after 9/11, highlighting both optimism and frustration.
OPEN Innovation to Face Off Data Center Challenges
Why Companies Should Apply the Power of OPEN Innovation to Data Center Infrastructure
3 Exec Insights on Cultivating Successful Industry Partnerships
Tech industry vet Lynn Comp explores the benefits of industry partnerships and why it’s critical to understand one’s own business drivers and their partner’s to achieve success.
Iceotope Delivers Great Chemistry for Cool Data Centers
Iceotope's liquid cooling tech is shaking up data centers as AI drives the need for efficient heat management. Dr. Kelley Mullick explains the shift from air to liquid cooling, highlighting Iceotope's sustainable solutions.
It’s No Coincidence that Wait-and-See Rhymes with Latency
Jim Fister dives deep into the intricacies of system memory, latency, and data management, exploring how modern computing architectures handle data retrieval and processing.
Advanced Packaging: Driving the AI Era Forward
AI is driving an acceleration of compute demands fueled by the proliferation of large language models across industry use cases. This requirement comes as traditional semiconductor technology pushes against the laws of physics with the slowing of Moore’s Law.
Flex Demonstrates Leadership with Acquisition of JetCool
Flex strengthens its direct liquid cooling portfolio with its acquisition of JetCool, adding their MIT-developed tech to Flex’s broad offerings across power, cooling and data center infrastructure.
JetCool Tackles AI’s Power Demands with Precision Cooling
JetCool's innovative liquid cooling targets hotspots directly, supporting AI's growing power needs while enhancing sustainability through efficient heat reuse and scalable solutions for data centers.
CoolIT: Leading the Pack on Liquid Cooling
CoolIT Systems is driving efficiency and performance for AI in data centers with cutting-edge liquid cooling solutions.
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
Arm advances data center tech with power-efficient CPUs, modular chiplet designs, and the scalable Neoverse platform, supporting hyperscalers and AI workloads with sustainable, adaptive solutions.
Boo! TechArena's Spookiest Tech Trends Heading to 2025
This Halloween, TechArena explores 2025’s top spooky tech trends: zombie data haunting storage, AI hallucinations leading to false data, and cyborg advances redefining humanity!
3 Top Takeaways from OCP Summit
The 2024 OCP Summit spotlighted performance, power, and standards in the AI era, delivering record attendance and more than one jaw-dropping announcement. Check out our top takeaways from the event.
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Podcasts
The Rising Demands on Cloud Infrastructure
TechArena host Allyson Klein chats with Cloudflare infrastructure VP and Open Compute Board Chair Rebecca Weekly about the rising demands on cloud infrastructure across performance, design modularity, and sustainability.
The State of Cloud Automation with Abby Kearns
TechArena host Allyson Klein chats with cloud innovator Abby Kearns about the state of cloud automation and how further advancement is required to keep apace of growing cloud complexity.
Couture Silicon for the Cloud
TechArena host Allyson Klein talks with Ampere Chief Product Officer Jeff Wittich on rise of Ampere fueled computing in the cloud and why Ampere's lineup places it in an excellent position for the next wave of cloud growth.
Universal Storage Disruption - Vast Data Podcast
Allyson chats with Vast Data co-founder and CMO Jeff Denworth about Universal Storage and why it aims to disrupt traditional data paradigms.
Revolutionizing RAID: Graid's Supreme Solution for Modern Data Challenges
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Accelerating European Data Center Buildout with OCP’s Raul Alvarez
TechArena host Allyson Klein chats with OCP’s Raul Alvarez on his new charter accelerating growth of the data center market in Europe as well as his ongoing work in immersion cooling technologies from OCP Lisbon 2024.
