Data Center
Highlights
Why Small Chiplets are a BIG Deal
Chiplets are transforming processor design, enabling greater performance, efficiency, and scalability. Matty Bakkeren’s latest blog explores how chiplets are reshaping the future of computing.
Fortinet: Active Security for a Rapidly Evolving Threat Landscape
With cybercrime costs soaring to $10.5T by 2030, IT leaders need smarter security. Fortinet’s AI-powered solutions enhance threat detection, automate response, and protect cloud environments at scale.
Catchpoint’s Powerful Approach to Internet Monitoring and Security
In our continuing Cloud Field Day coverage, explore Catchpoint’s approach to proactive internet monitoring and how its IPM platform enhances user experience, brand protection, and revenue growth.
Infoblox Heralds a New Era for DDI
In this Cloud Field Day blog, Allyson Klein covers Infoblox’s unified DDI platform, tackling multi-cloud complexity, security risks, and IP conflicts for seamless management and enterprise protection.
Top Trends I'm Tracking at Cloud Field Day 22
As a delegate at Cloud Field Day 22, our own Allyson Klein kicks off her coverage of the event by discussing the top trends she’s following this week in Silicon Valley. Stay tuned!
Exploring the Latest in IO Chiplets with Alphawave Semi
In this video from Chiplet Summit, learn about Alphawave Semi’s new AlphaCHIP1600-IO, an industry-first multi-protocol IO chiplet supporting PCIe Gen 6, CXL 3.1, and 800G Ethernet.
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Podcasts
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Driving Sustainable Data Center Infrastructure for the Next Wave of Greenfield Buildout with Jon Summers
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
Disruptive Chiplet Innovation Delivers the Next Wave of Data Center Performance with Palo Alto Electron’s Jawad Nasrullah
TechArena host Allyson Klein chats with Palo Alto Electron CEO Jawad Nasrullah about his vision for an open chiplet economy, the semiconductor manufacturing hurdles standing in the way of broad chiplet market delivery, and how he plans to play a role in shaping this next evolution of the semiconductor landscape.
Connectivity Innovation for Scalable Data Movement in the AI Era with Credo’s Don Barnetson
TechArena host Allyson Klein chats with Credo VP Don Barnetson about how his company is delivering innovative optical solutions that address the AI era’s requirements for scalable data movement in the data center and beyond from OCP Lisbon 2024.
The Cutting Edge of Data Center Infrastructure Innovation with OCP’s Steve Helvie
TechArena host Allyson Klein chats with Open Compute Project VP of Emerging Markets, Steve Helvie, about the proceedings in Lisbon this week and how OCP is helping to shape the cutting edge of infrastructure innovation.
Re-imagining Memory through Advanced Chiplet Innovation with ZeroPoint Technologies’ Nilesh Shah
TechArena host Allyson Klein chats with ZeroPoint Technologies’ VP of Business Development Nilesh Shah about the AI era demands for memory innovation, how advanced chiplet architectures will assist semiconductor teams in advancing memory access for balanced system delivery, and how ZeroPoint Technologies plans to play a strategic role in this major market transition.
Innovating OpenBMC Enabled Shared Firmware Across the Network with HPE’s Jean-Marie Verdun
TechArena host Allyson Klein chats with HPE’s Jean-Marie Verdun about his organization’s groundbreaking work to redefine firmware management using OpenBMC technology and how this breakthrough addresses data center customer demands.
Advancing Sustainable Infrastructure to Fuel Hungry Workloads with CircleB's Matty Bakkeren
TechArena host Allyson Klein chats with CircleB’s Matty Bakkeren about how his organization is leveraging OCP specifications to deliver innovative and sustainable solutions to data center customers, how AI is re-shaping operator requirements, and how he sees the market shaping in 2024.
Data Insights Series Sponsored by Solidigm: Achieving AI Scale with CoreWeave
TechArena hosts Allyson Klein and Jeniece Wronowski chat with CoreWeave’s Jacob Yundt about how his organization is delivering a scalable data pipeline to AI customers utilizing breakthrough VAST Data solutions featuring Solidigm QLC SSDs.
