Data Center
articles
AI Is Squeezing Storage Supply—and VAST Wants Your Flash
AI demand is tightening HDD and NAND supply—and prices may follow. VAST is betting on flash reclamation and KV-cache persistence as storage starts acting more like memory.
RackRenew Turns Decommissioned OCP Hardware into Ready Capacity
RackRenew remanufactures OCP compliant-infrastructure into certified, warranty-backed assemblies—standardized, tested, and ready to deploy for faster capacity without bespoke engineering.
5 Data Infrastructure Shifts That Will Define Enterprise AI in 2026
These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
OCP 2025: Arm’s Chiplet Play Aims To Democratize AI Compute
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Achieving HPC Performance with Xeon 6 Processors
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
AI Is Squeezing Storage Supply—and VAST Wants Your Flash
AI demand is tightening HDD and NAND supply—and prices may follow. VAST is betting on flash reclamation and KV-cache persistence as storage starts acting more like memory.
RackRenew Turns Decommissioned OCP Hardware into Ready Capacity
RackRenew remanufactures OCP compliant-infrastructure into certified, warranty-backed assemblies—standardized, tested, and ready to deploy for faster capacity without bespoke engineering.
5 Data Infrastructure Shifts That Will Define Enterprise AI in 2026
These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
OCP 2025: Arm’s Chiplet Play Aims To Democratize AI Compute
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Achieving HPC Performance with Xeon 6 Processors
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
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Podcasts
Innovating OpenBMC Enabled Shared Firmware Across the Network with HPE’s Jean-Marie Verdun
TechArena host Allyson Klein chats with HPE’s Jean-Marie Verdun about his organization’s groundbreaking work to redefine firmware management using OpenBMC technology and how this breakthrough addresses data center customer demands.
Advancing Sustainable Infrastructure to Fuel Hungry Workloads with CircleB's Matty Bakkeren
TechArena host Allyson Klein chats with CircleB’s Matty Bakkeren about how his organization is leveraging OCP specifications to deliver innovative and sustainable solutions to data center customers, how AI is re-shaping operator requirements, and how he sees the market shaping in 2024.
Data Insights Series Sponsored by Solidigm: Achieving AI Scale with CoreWeave
TechArena hosts Allyson Klein and Jeniece Wronowski chat with CoreWeave’s Jacob Yundt about how his organization is delivering a scalable data pipeline to AI customers utilizing breakthrough VAST Data solutions featuring Solidigm QLC SSDs.
Exploring Data in the AI Era with Solidigm - New Data Insights Series
The TechArena kicks off a Data Insights Series in collaboration with Solidigm, and TechArena host welcomes co-host Jeniece Wronowski and Solidigm data center marketing director Ace Stryker to the program to talk about data in the AI era, the series objectives, and how SSD innovation sits at the foundation of a new data pipeline.
Charting Architectural Innovation in the Chiplet Era with OCP's Cliff Grossner
TechArena host Allyson Klein chats with OCP’s Cliff Grossner regarding the chiplet era, how architectural evolution has evolved to a chiplet economy, and how the OCP is helping create an open marketplace for innovation.
Building Composable Data Systems with Voltron Data CEO Josh Patterson
TechArena host Allyson Klein chats with Voltron Data CEO Josh Patterson about delivery of Theseus, a composable data system framework that unleashes develops with new interoperability and flexibility for AI era data challenges.
OCP, Power Grids & Open Racks — with Dr. Andrew Chien
From OCP Summit San Jose, Allyson Klein and co-host Jeniece Wnorowski interview Dr. Andrew Chien (UChicago & Argonne) on grid interconnects, rack-scale standards, and how openness speeds innovation.
Ventiva Reinvents Cooling with Silent Airflow Tech
Ventiva CEO Carl Schlachte joins Allyson Klein to share how the company’s Ionic Cooling Engine is transforming laptops, servers, and beyond with silent, modular airflow.
Cracking the Code on Storage Efficiency with Solidigm
Explore myths, metrics, and strategies shaping the future of energy-efficient data centers with Solidigm’s Scott Shadley, from smarter drives to sustainability-ready architectures.
Immersion Cooling: Revolutionizing AI & Edge Computing
Allyson Klein and Jeniece Wnorowski welcome Mohan Potheri of Hypertec to explore how immersion cooling slashes energy use, shrinks data-center footprints, and powers sustainable, high-density AI, HPC, and edge solutions on this Data Insights episode.
SayTEC Powers Scalable, Secure, Sovereign IT Infrastructure
SayTEC redefines IT with a zero trust, hyper-converged platform delivering sovereign cloud, seamless scalability, and military-grade security for critical industries.
Flexibility at the Edge: Pragmatic Semiconductor’s Bold Approach
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
