Data Center
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VAST and CoreWeave Sign $1.17B Deal to Power AI Data Layer
Multi-year agreement makes VAST AI OS CoreWeave’s primary data foundation, aligning roadmaps for instant dataset access and performance across training and real-time inference in global AI cloud regions.
Avayla and OCP Redefine Cooling Standards for the AI Age
At the OCP Global Summit, Avayla CEO Kelley Mullick reveals how rapid standardization and hybrid cooling strategies are reshaping infrastructure for the AI era.
Open-Source AI and the Road to Broad Deployment
Open models move fast—but production doesn’t forgive surprises. Lynn Comp maps how to pair open-source AI with a solid CPU foundation and orchestration to scale from pilot to platform.
A Guide to On-Premises and First-Party Cloud-Native Storage
What modern storage really means, how on-prem arrays compare to first-party cloud services, and a clear checklist to pick the right fit for cost, control, scalability, and resilience.
Cooling for the Gigawatt Era: JetCool’s Roadmap for AI Data Centers
As part of Flex, JetCool is scaling its microconvective cooling technology to help hyperscalers deploy next-gen systems faster, streamlining cooling deployments from server to rack in the AI era.
From Laptops to Data Center Racks: Ventiva’s Thermal Play at OCP
Ventiva discusses how hard-won laptop cooling know-how can unlock inside-the-box gains for AI servers and racks—stabilizing hotspots, preserving acoustics, and boosting performance.
GTC DC: NVIDIA’s Big Bets on AI Factories, DOE, and 6G
At GTC DC, NVIDIA outlined DOE-scale AI systems, debuted NVQLink to couple GPUs and quantum, partnered with Nokia on AI-RAN to 6G, mapped Uber robotaxis for 2027, and highlighted Synopsys’ GPU gains.
CelLink at OCP: 3 Key Takeaways for AI Factories
Design shifted to rack-scale. Power and cooling span the full path. Liquid is table stakes. Three takeaways from OCP 2025—and why CelLink’s PowerPlane fits an AI-factory mindset.
Xinnor Reinvents RAID for the Era of AI-Driven Data Centers
Traditional data protection becomes the bottleneck when GPU idle time costs millions. Joint testing with Solidigm shows how next-generation solutions maintain full speed during drive failures.
CFD24: HPE Bets on a “Cool-Again” Private Cloud Strategy
From provisioning to observability to protection, HPE’s expanding cloud software suite targets the repatriation wave.
When AI is a Bad Actor's Best Friend: Fortinet at CFD24
LLMs have given attackers new angles. Fortinet showed, step by step, how AI-driven probes escalate—and how FortiGate, FortiWeb, FortiAnalyzer, and FortiSOAR close the door without slowing the business.
5 Ways To Keep GPUs Fed—Hard-Won Lessons From Our AI Factory Panel
From racks and liquid loops to data placement and standards pace, five takeaways from CoreWeave, Dell, NVIDIA, Solidigm, and VAST Data on building AI factories that keep accelerators busy and dollars well-spent.
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Podcasts
Powering AI with ZincFive’s Sustainable Battery Solutions
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Revolutionizing RAID: Graid's Supreme Solution for Modern Data Challenges
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Immersion Cooling: Revolutionizing AI & Edge Computing
Allyson Klein and Jeniece Wnorowski welcome Mohan Potheri of Hypertec to explore how immersion cooling slashes energy use, shrinks data-center footprints, and powers sustainable, high-density AI, HPC, and edge solutions on this Data Insights episode.
SayTEC Powers Scalable, Secure, Sovereign IT Infrastructure
SayTEC redefines IT with a zero trust, hyper-converged platform delivering sovereign cloud, seamless scalability, and military-grade security for critical industries.
Flexibility at the Edge: Pragmatic Semiconductor’s Bold Approach
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
Protecting Against Quantum Cybersecurity Threats with Winbond
In this In the Arena episode, Winbond’s Jun Kawaguchi discusses their industry-leading strategies for tackling next-gen cybersecurity threats, ensuring robust protection for the future.
PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
Bill Gropp on the NCSA and the Future of Supercomputing Innovation
In this podcast, NCSA Director Bill Gropp explores the latest advanced computing trends, from AI innovations to groundbreaking research on supercomputing climate models, and how this tech is transforming science and society.
