Presenting at Cloud Field Day 24, Pure pitched fleet-level automation across mixed environments as the antidote to storage silos, promising one control plane for legacy systems and modern workloads.
A 2025 field guide for architects: why Arm’s software gravity and hyperscaler adoption make it the low-friction path today, where RISC-V is gaining ground, and the curveballs that could reshape both.
The cloud security architect who came from networking explains her framework for separating tech hype from genuine innovation, and why stepping away is key to solving hard problems.
Industry leaders reveal why data-centric, change-ready data center architectures will determine who thrives in the age of unpredictable AI advancements.
Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.
Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.
Design shifted to rack-scale. Power and cooling span the full path. Liquid is table stakes. Three takeaways from OCP 2025—and why CelLink’s PowerPlane fits an AI-factory mindset.
Traditional data protection becomes the bottleneck when GPU idle time costs millions. Joint testing with Solidigm shows how next-generation solutions maintain full speed during drive failures.
From provisioning to observability to protection, HPE’s expanding cloud software suite targets the repatriation wave.
LLMs have given attackers new angles. Fortinet showed, step by step, how AI-driven probes escalate—and how FortiGate, FortiWeb, FortiAnalyzer, and FortiSOAR close the door without slowing the business.
From racks and liquid loops to data placement and standards pace, five takeaways from CoreWeave, Dell, NVIDIA, Solidigm, and VAST Data on building AI factories that keep accelerators busy and dollars well-spent.
At Cloud Field Day 24, Oxide outlines a vertically integrated rack—custom hypervisor, integrated power/network, and open integrations—aimed at bringing hyperscale efficiency and faster deploys to enterprise DCs.
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
In this In the Arena episode, Winbond’s Jun Kawaguchi discusses their industry-leading strategies for tackling next-gen cybersecurity threats, ensuring robust protection for the future.
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
In this podcast, NCSA Director Bill Gropp explores the latest advanced computing trends, from AI innovations to groundbreaking research on supercomputing climate models, and how this tech is transforming science and society.
Discover how AI is transforming data centers, with innovations in high-speed networking, emulation, and hyperscale infrastructure driving efficiency and performance in the era of AI workloads.
OCP’s Rob Coyle shares insights on AI, cooling innovations, and open hardware’s role in transforming data centers as the industry accelerates toward scalable, sustainable infrastructure.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.