Traditional data protection becomes the bottleneck when GPU idle time costs millions. Joint testing with Solidigm shows how next-generation solutions maintain full speed during drive failures.
From provisioning to observability to protection, HPE’s expanding cloud software suite targets the repatriation wave.
LLMs have given attackers new angles. Fortinet showed, step by step, how AI-driven probes escalate—and how FortiGate, FortiWeb, FortiAnalyzer, and FortiSOAR close the door without slowing the business.
From racks and liquid loops to data placement and standards pace, five takeaways from CoreWeave, Dell, NVIDIA, Solidigm, and VAST Data on building AI factories that keep accelerators busy and dollars well-spent.
At Cloud Field Day 24, Oxide outlines a vertically integrated rack—custom hypervisor, integrated power/network, and open integrations—aimed at bringing hyperscale efficiency and faster deploys to enterprise DCs.
Presenting at Cloud Field Day 24, Pure pitched fleet-level automation across mixed environments as the antidote to storage silos, promising one control plane for legacy systems and modern workloads.
In this video from Chiplet Summit, learn about Alphawave Semi’s new AlphaCHIP1600-IO, an industry-first multi-protocol IO chiplet supporting PCIe Gen 6, CXL 3.1, and 800G Ethernet.
As quantum computing advances, Winbond is pioneering post-quantum cryptography to safeguard data against emerging threats. Learn how they’re preparing for the quantum security revolution.
In this video, learn why Arm is investing in chiplets as a way to build dynamic options for compute in the AI era, and hear more about their new Chiplet Standard Architecture Specification.
With Data Privacy Week around the corner, Cyber Innovator Sean Grimaldi breaks down how phishing tactics exploit trust and human error. Learn strategies to defend against this evolving threat.
In this report, discover the 2025 predictions of TechArena’s Voices of Innovation – industry experts who forecasting what’s on the horizon in AI, data centers, edge, network, sustainability and more.
Interested in what’s on the horizon for tech in 2025? Jim Fister’s latest article delves into the future of work, the emergence of AI-as-a-service, global innovation and several more geeky insights for the year ahead.
TechArena host Allyson Klein chats with AMD senior fellow and CXL technical taskforce co-chair Mahesh Wagh regarding AMD’s entry of CXL platforms into the market gen 4 AMD EYPC processors and his organization’s strategy to deliver disruptive innovation utilizing CXL capability in the years ahead.
TechArena host Allyson Klein chats with NVIDIA Data Center Product Architect and Universal Chiplet Interconnect Express organization board member Durgesh Srivastava about the new UCIe specification and how it will reshape the foundations of compute architectures.
TechArena host talks with Bev Crair, Senior Vice President of Oracle Cloud Infrastructure Compute about her team’s delivery of bespoke services and efforts to simplify multi-cloud adoption.
TechArena host Allyson Klein chats with Checkpoint Software's TJ Gonen about the state of cloud security and how security solutions must start with a developer lens
TechArena host Allyson Klein chats with Cloudflare infrastructure VP and Open Compute Board Chair Rebecca Weekly about the rising demands on cloud infrastructure across performance, design modularity, and sustainability.
TechArena host Allyson Klein chats with cloud innovator Abby Kearns about the state of cloud automation and how further advancement is required to keep apace of growing cloud complexity.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.