From childhood gaming consoles to guiding Intel’s message to market, Allyson Klein has spent decades proving that the best tech stories happen when engineers feel invited to share what they’ve created.
At Cloud Field Day 23, Qumulo showcased its cloud data fabric, unifying hybrid environments and solving real-world challenges in media, pharma, public safety, and more with strict data consistency.
A solution from HPE and SAP aims to simplify SAP Cloud ERP adoption with managed private cloud, ecosystem integration, and AI agents for enterprise transformation.
At Cloud Field Day 23, Scality highlighted real-world deployments that tackle petabyte-scale challenges with resilience, flexibility, and customer-driven innovation.
As AI drives explosive data growth, next-gen SSDs deliver the speed, density, and efficiency to outpace HDDs—reshaping storage strategy for tomorrow’s data-centric data centers.
The Common Vulnerabilities and Exposures (CVE) landscape is shifting—governance is changing, and security pros are moving beyond raw CVE counts to focus on context-aware, risk-based vulnerability management.
Traditional data protection becomes the bottleneck when GPU idle time costs millions. Joint testing with Solidigm shows how next-generation solutions maintain full speed during drive failures.
From provisioning to observability to protection, HPE’s expanding cloud software suite targets the repatriation wave.
LLMs have given attackers new angles. Fortinet showed, step by step, how AI-driven probes escalate—and how FortiGate, FortiWeb, FortiAnalyzer, and FortiSOAR close the door without slowing the business.
From racks and liquid loops to data placement and standards pace, five takeaways from CoreWeave, Dell, NVIDIA, Solidigm, and VAST Data on building AI factories that keep accelerators busy and dollars well-spent.
At Cloud Field Day 24, Oxide outlines a vertically integrated rack—custom hypervisor, integrated power/network, and open integrations—aimed at bringing hyperscale efficiency and faster deploys to enterprise DCs.
Presenting at Cloud Field Day 24, Pure pitched fleet-level automation across mixed environments as the antidote to storage silos, promising one control plane for legacy systems and modern workloads.
From SC25 in St. Louis, Nebius shares how its neocloud, Token Factory PaaS, and supercomputer-class infrastructure are reshaping AI workloads, enterprise adoption, and efficiency at hyperscale.
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From SC25 in St. Louis, Nebius shares how its neocloud, Token Factory PaaS, and supercomputer-class infrastructure are reshaping AI workloads, enterprise adoption, and efficiency at hyperscale.
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.