At Cloud Field Day 24, Oxide outlines a vertically integrated rack—custom hypervisor, integrated power/network, and open integrations—aimed at bringing hyperscale efficiency and faster deploys to enterprise DCs.
Presenting at Cloud Field Day 24, Pure pitched fleet-level automation across mixed environments as the antidote to storage silos, promising one control plane for legacy systems and modern workloads.
A 2025 field guide for architects: why Arm’s software gravity and hyperscaler adoption make it the low-friction path today, where RISC-V is gaining ground, and the curveballs that could reshape both.
The cloud security architect who came from networking explains her framework for separating tech hype from genuine innovation, and why stepping away is key to solving hard problems.
Industry leaders reveal why data-centric, change-ready data center architectures will determine who thrives in the age of unpredictable AI advancements.
Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.
Multi-year agreement makes VAST AI OS CoreWeave’s primary data foundation, aligning roadmaps for instant dataset access and performance across training and real-time inference in global AI cloud regions.
At the OCP Global Summit, Avayla CEO Kelley Mullick reveals how rapid standardization and hybrid cooling strategies are reshaping infrastructure for the AI era.
Open models move fast—but production doesn’t forgive surprises. Lynn Comp maps how to pair open-source AI with a solid CPU foundation and orchestration to scale from pilot to platform.
What modern storage really means, how on-prem arrays compare to first-party cloud services, and a clear checklist to pick the right fit for cost, control, scalability, and resilience.
As part of Flex, JetCool is scaling its microconvective cooling technology to help hyperscalers deploy next-gen systems faster, streamlining cooling deployments from server to rack in the AI era.
Ventiva discusses how hard-won laptop cooling know-how can unlock inside-the-box gains for AI servers and racks—stabilizing hotspots, preserving acoustics, and boosting performance.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.
From OCP Summit San Jose, Allyson Klein and co-host Jeniece Wnorowski interview Dr. Andrew Chien (UChicago & Argonne) on grid interconnects, rack-scale standards, and how openness speeds innovation.
From the OCP Global Summit in San Jose, Allyson Klein sits down with Chris Butler of Flex to unpack how the company is collapsing the gap between IT and power—literally and figuratively.
From OCP Summit 2025, Kelley Mullick joins Allyson Klein and co-host Jeniece Wnorowski for a Data Insights episode on rack-scale design, hybrid cooling (incl. immersion heat recapture), and open standards.
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.