Data Center
articles
From Box to Building—How Open Compute Is Rewiring the AI Factory
Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.
OCP 2025: Open is the Only Way We Scale the AI Data Center
Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.
Arm Joins OCP Board, Contributes Chiplet Architecture Spec
Appointment to Open Compute Project Foundation board of directors, contribution of Foundation Chiplet System Architecture (FCSA) spec underscore Arm’s ascendency in hyperscale, AI data centers.
CelLink Flex Harnesses Enable the AI Power Revolution
CelLink’s ultrathin flex harnessing ushers in a new era in compute infrastructure innovation, cutting cable volume by up to 90% and boosting density, reliability, and efficiency.
Giving Storage Strategy a Reboot for Efficiency with Solidigm
As AI workloads push storage power consumption higher, the path to true storage efficiency demands systems-level thinking including hardware, software, and better metrics for picking the right drives.
Cirrascale CEO on Defining Compute Efficiency
Dave Driggers, CEO of Cirrascale, breaks down what “compute efficiency” really means, from GPU utilization and TCO modeling to token-based pricing that drives predictable customer value.
From Laptops to Data Center Racks: Ventiva’s Thermal Play at OCP
Ventiva discusses how hard-won laptop cooling know-how can unlock inside-the-box gains for AI servers and racks—stabilizing hotspots, preserving acoustics, and boosting performance.
GTC DC: NVIDIA’s Big Bets on AI Factories, DOE, and 6G
At GTC DC, NVIDIA outlined DOE-scale AI systems, debuted NVQLink to couple GPUs and quantum, partnered with Nokia on AI-RAN to 6G, mapped Uber robotaxis for 2027, and highlighted Synopsys’ GPU gains.
CelLink at OCP: 3 Key Takeaways for AI Factories
Design shifted to rack-scale. Power and cooling span the full path. Liquid is table stakes. Three takeaways from OCP 2025—and why CelLink’s PowerPlane fits an AI-factory mindset.
Xinnor Reinvents RAID for the Era of AI-Driven Data Centers
Traditional data protection becomes the bottleneck when GPU idle time costs millions. Joint testing with Solidigm shows how next-generation solutions maintain full speed during drive failures.
CFD24: HPE Bets on a “Cool-Again” Private Cloud Strategy
From provisioning to observability to protection, HPE’s expanding cloud software suite targets the repatriation wave.
When AI is a Bad Actor's Best Friend: Fortinet at CFD24
LLMs have given attackers new angles. Fortinet showed, step by step, how AI-driven probes escalate—and how FortiGate, FortiWeb, FortiAnalyzer, and FortiSOAR close the door without slowing the business.
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Podcasts
From OCP 2025: Arm’s Chiplet Push and the AI Ecosystem Play
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
PEAK:AIO on Smarter Storage for AI—Data Insights @ OCP
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
CelLink PowerPlane: Flat Power for AI Server Racks
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Hybrid Quantum + HPC: CESQ’s Lesya Dymyd at OCP 2025
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
Connectivity for the AI Era with Alphawave Semi’s Tony Chan Carusone
TechArena host Allyson Klein chats with Alphawave Semi’s CTO Tony Chan Carusone regarding the unique opportunity for connectivity innovation to fuel the era of AI and why Alphawave is perfectly poised for IP, chiplet and custom solution delivery.
Exploring the Birth of the Universe with the NASA Webb Telescope
TechArena host Allyson Klein sits down with NASA’s Matt Greenhouse to discuss the Webb telescope project, a mission he has been working on for decades, and how it will shape our understanding of the birth of the universe, exoplanets, and potentially life beyond Earth.
Scalable, Open-Source Authorization with Cerbos
TechArena host Allyson Klein talks with Cerbos co-founder and CEO Emre Baran of the importance of authorization solutions and why he founded Cerbos to deliver scalable code that developers can seamlessly integrate into cloud native applications.
Disruptive Security Advancement with VectorZero
TechArena host Allyson Klein chats with VectorZero CTO and co-founder Sean Grimaldi about his extensive experience fighting bad actors to protect the nation’s security and how his learning at the CIA has informed his approach to elimination of attack vectors at VectorZero.
Observability in the Era of Distributed Computing with cPacket Networks
TechArena host Allyson Klein chats with cPacket Networks CTO Ron Nevo about how observability has evolved for a multi-cloud to edge era and why his company is delivering four key components of observability solutions to customers.
Phoenix Rising: The Future of CPU Innovation with AMD
TechArena host Allyson Klein chats with AMD's Lynn Comp about the changing landscape of CPU design and how AMD is poised to lead future innovation.
