Thoughts on the state of cloud stack management and automation with the rise of cloud management complexity.
As we reach the 25th anniversary of cloud computing we set off to see what technology innovations will shape the next wave of cloud computing adoption.
A recap of SC’22 with a focus on silicon, platform, and scientific innovation highlights.
Have you ever heard of Universal Storage? It’s a new class of storage management which is challenging the standard storage pyramid driven by a disruptive force of a company called Vast Data.
TechArena spoke to over a dozen industry experts from OVH, Qarnot, PLVision, ZeroPoint Technologies, the Research Institutes of Sweden, London South Bank University, and the Open Compute Project to publish this comprehensive report on the state of open compute infrastructure innovation and how organizations should align data center planning and oversight with sustainability and performance objectives. If you manage an IT organization or oversee data center infrastructure, software, or sustainability initiatives, this report offers practical value for your organization.
TechArena’s take on Microsoft Build announcement of the world’s first MI300X instances arriving on Azure AI.
TechArena’s take on a recent Data Insights conversation featuring Supermicro and Solidigm on how Supermicro’s solutions are targeting AI data pipeline requirements and the role SSDs play in delivering high performance, efficiency and density for Supermicro solutions.
We kick off this week’s reporting from Open Compute Project’s Regional Summit in Lisbon with some thoughts on historic innovation and how it shapes society.
The TechArena’s reflection on the disruptive innovation that CoreWeave is driving into the AI service arena fueled by Solidigm QLC NAND and VAST Data platform innovation.
VAST Data reveals more of their AI strategy with collaboration announcements with NVIDIA and Supermicro.
From SC25 in St. Louis, Nebius shares how its neocloud, Token Factory PaaS, and supercomputer-class infrastructure are reshaping AI workloads, enterprise adoption, and efficiency at hyperscale.
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From SC25 in St. Louis, Nebius shares how its neocloud, Token Factory PaaS, and supercomputer-class infrastructure are reshaping AI workloads, enterprise adoption, and efficiency at hyperscale.
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.