Data Center
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Exploring the Latest in IO Chiplets with Alphawave Semi
In this video from Chiplet Summit, learn about Alphawave Semi’s new AlphaCHIP1600-IO, an industry-first multi-protocol IO chiplet supporting PCIe Gen 6, CXL 3.1, and 800G Ethernet.
Security for the Quantum Age with Winbond
As quantum computing advances, Winbond is pioneering post-quantum cryptography to safeguard data against emerging threats. Learn how they’re preparing for the quantum security revolution.
Arm Defines a New Standard for Chiplet Interoperability
In this video, learn why Arm is investing in chiplets as a way to build dynamic options for compute in the AI era, and hear more about their new Chiplet Standard Architecture Specification.
Tale of a Trained Phishing Target
With Data Privacy Week around the corner, Cyber Innovator Sean Grimaldi breaks down how phishing tactics exploit trust and human error. Learn strategies to defend against this evolving threat.
TechArena 2025 Predictions Report
In this report, discover the 2025 predictions of TechArena’s Voices of Innovation – industry experts who forecasting what’s on the horizon in AI, data centers, edge, network, sustainability and more.
1011 Fact-Based Guesses for 2025
Interested in what’s on the horizon for tech in 2025? Jim Fister’s latest article delves into the future of work, the emergence of AI-as-a-service, global innovation and several more geeky insights for the year ahead.
OCP 2025: Arm’s Chiplet Play Aims To Democratize AI Compute
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Inside SC25: AI Factories From Racks to Qubits
From WEKA’s memory grid and exabyte storage to 800G fabrics, liquid-cooled AI factories, edge clusters, and emerging quantum accelerators, SC25 proved HPC is now about end-to-end AI infrastructure.
Achieving HPC Performance with Xeon 6 Processors
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
KubeCon Atlanta: CNCF Sets AI Standard for Kubernetes
On Day 1 of KubeCon + CloudNativeCon Atlanta, CNCF unveiled Kubernetes AI Conformance to make workloads portable—arriving as inference surges to ~1.33 quadrillion tokens/month across Google’s systems.
VAST and CoreWeave Sign $1.17B Deal to Power AI Data Layer
Multi-year agreement makes VAST AI OS CoreWeave’s primary data foundation, aligning roadmaps for instant dataset access and performance across training and real-time inference in global AI cloud regions.
Avayla and OCP Redefine Cooling Standards for the AI Age
At the OCP Global Summit, Avayla CEO Kelley Mullick reveals how rapid standardization and hybrid cooling strategies are reshaping infrastructure for the AI era.
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Podcasts
Nebius at SC25: Building the Neocloud for Enterprise AI
From SC25 in St. Louis, Nebius shares how its neocloud, Token Factory PaaS, and supercomputer-class infrastructure are reshaping AI workloads, enterprise adoption, and efficiency at hyperscale.
Giga Computing on Rack-Scale AI: From Training to Inference
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
RackRenew & Circularity: Remanufacture, Recertify, Redeploy
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
From OCP 2025: Arm’s Chiplet Push and the AI Ecosystem Play
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Driving Sustainable Data Center Infrastructure for the Next Wave of Greenfield Buildout with Jon Summers
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
Disruptive Chiplet Innovation Delivers the Next Wave of Data Center Performance with Palo Alto Electron’s Jawad Nasrullah
TechArena host Allyson Klein chats with Palo Alto Electron CEO Jawad Nasrullah about his vision for an open chiplet economy, the semiconductor manufacturing hurdles standing in the way of broad chiplet market delivery, and how he plans to play a role in shaping this next evolution of the semiconductor landscape.
Accelerating European Data Center Buildout with OCP’s Raul Alvarez
TechArena host Allyson Klein chats with OCP’s Raul Alvarez on his new charter accelerating growth of the data center market in Europe as well as his ongoing work in immersion cooling technologies from OCP Lisbon 2024.
Delivering a Sustainable Data Platform for the AI Era with Weka, Data Insights Series Sponsored by Solidigm
TechArena host Allyson Klein and Solidigm’s Jeniece Wnorowski chat with Weka’s Joel Kaufman, as he tours the Weka data platform and how the company’s innovation provides sustainable data management that scales for the AI era.
SONIC Network Innovation for the AI Era with PLVision’s Taras Chornyi
TechArena host Allyson Klein chats with PLVision Director of Open Networking Solutions and Strategy, Taras Chornyi, about the progress of SONIC and open network infrastructure for the AI Era.
