In this video, learn why Arm is investing in chiplets as a way to build dynamic options for compute in the AI era, and hear more about their new Chiplet Standard Architecture Specification.
With Data Privacy Week around the corner, Cyber Innovator Sean Grimaldi breaks down how phishing tactics exploit trust and human error. Learn strategies to defend against this evolving threat.
In this report, discover the 2025 predictions of TechArena’s Voices of Innovation – industry experts who forecasting what’s on the horizon in AI, data centers, edge, network, sustainability and more.
Interested in what’s on the horizon for tech in 2025? Jim Fister’s latest article delves into the future of work, the emergence of AI-as-a-service, global innovation and several more geeky insights for the year ahead.
Discover how Gigabyte expanded beyond gaming hardware to become a leader in data center innovation, AI infrastructure, advanced cooling solutions and open compute standards.
In this blog, Momenthesis’ Matty Bakkeren explores how AI integration, OCP growth, and data centers as energy assets will reshape the future of data infrastructure in 2025 and beyond.
As part of Flex, JetCool is scaling its microconvective cooling technology to help hyperscalers deploy next-gen systems faster, streamlining cooling deployments from server to rack in the AI era.
Ventiva discusses how hard-won laptop cooling know-how can unlock inside-the-box gains for AI servers and racks—stabilizing hotspots, preserving acoustics, and boosting performance.
At GTC DC, NVIDIA outlined DOE-scale AI systems, debuted NVQLink to couple GPUs and quantum, partnered with Nokia on AI-RAN to 6G, mapped Uber robotaxis for 2027, and highlighted Synopsys’ GPU gains.
Design shifted to rack-scale. Power and cooling span the full path. Liquid is table stakes. Three takeaways from OCP 2025—and why CelLink’s PowerPlane fits an AI-factory mindset.
Traditional data protection becomes the bottleneck when GPU idle time costs millions. Joint testing with Solidigm shows how next-generation solutions maintain full speed during drive failures.
From provisioning to observability to protection, HPE’s expanding cloud software suite targets the repatriation wave.
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
In this In the Arena episode, Winbond’s Jun Kawaguchi discusses their industry-leading strategies for tackling next-gen cybersecurity threats, ensuring robust protection for the future.
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
In this podcast, NCSA Director Bill Gropp explores the latest advanced computing trends, from AI innovations to groundbreaking research on supercomputing climate models, and how this tech is transforming science and society.
Discover how AI is transforming data centers, with innovations in high-speed networking, emulation, and hyperscale infrastructure driving efficiency and performance in the era of AI workloads.
OCP’s Rob Coyle shares insights on AI, cooling innovations, and open hardware’s role in transforming data centers as the industry accelerates toward scalable, sustainable infrastructure.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.