Lee Chee Ping is Technical Director for Lam Research, focusing on the advanced packaging segment. He has been in the semiconductor industry for more than 17 years with more than 11 years in advanced packaging. He now oversees a worldwide process team, engaging customers working on the advanced packaging market and technology area. Lee Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.