Ahead of OCP Dublin, Matty Bakkeren joins Allyson Klein to break down rack innovations, liquid cooling, sovereignty, and the trends shaping data center infrastructure across Europe.

As GenAI adoption accelerates, organizations must rethink security from the silicon up to safeguard trust, compliance, and the integrity of AI-driven decisions.

Certified flows, IP, and 3DIC packaging tools from Synopsys and TSMC accelerate next-gen chip design for A16, N2P, and beyond — powering the future of AI and HPC.