Embedded World North America 2024 takes place from October 8-10, 2024, in Austin, Texas. This event marks the expansion of the global Embedded World exhibition and conference into North America, providing a key platform for the embedded systems community. Attendees have the opportunity to explore the latest technologies, participate in technical sessions, and network with industry leaders from the embedded sector.
CES 2025 will take place from January 7-10, 2025, in Las Vegas, Nevada. As the world's largest consumer electronics show, CES showcases cutting-edge innovations across various industries, including AI, robotics, 5G, smart home devices, and automotive technologies. It attracts top tech companies, startups, and industry leaders who reveal their latest products and breakthrough innovations. The event offers opportunities for networking, product launches, and thought leadership through keynote speeches and panel discussions. Targeted at tech enthusiasts, investors, and business leaders, CES is essential for anyone looking to stay ahead of emerging trends and disruptive technologies shaping the future.
PCMA Convening Leaders 2025 will be held from January 12-15, 2025, in Houston, Texas. This premier event for business events professionals brings together global leaders to discuss the latest trends and innovations in event management, experience design, and business strategy. Through educational sessions, networking opportunities, and hands-on workshops, attendees will explore how to create impactful, engaging events in an ever-evolving landscape. Targeted at meeting planners, event organizers, and industry executives, Convening Leaders provides essential insights into future-proofing events, driving engagement, and leveraging new technologies to enhance attendee experiences. It's a must-attend for anyone shaping the future of live and hybrid events.
Chiplet Summit 2025 will be held from January 21-23, 2025, in Santa Clara, California. This event is focused on the rapidly evolving chiplet technology that is transforming semiconductor design. Attendees will explore advancements in chiplet-based architectures, packaging, and interconnect solutions through keynote speeches, technical sessions, and exhibitions. The summit is tailored for engineers, designers, and business leaders in AI, data centers, and consumer electronics, providing insights into improving scalability and time-to-market for next-generation chips. It’s an essential event for anyone involved in driving semiconductor innovation and efficiency.