Chiplet Summit 2025 will be held from January 21-23, 2025, in Santa Clara, California. This event is focused on the rapidly evolving chiplet technology that is transforming semiconductor design. Attendees will explore advancements in chiplet-based architectures, packaging, and interconnect solutions through keynote speeches, technical sessions, and exhibitions. The summit is tailored for engineers, designers, and business leaders in AI, data centers, and consumer electronics, providing insights into improving scalability and time-to-market for next-generation chips. It’s an essential event for anyone involved in driving semiconductor innovation and efficiency.
Exploring the Latest in IO Chiplets with Alphawave Semi
In this video from Chiplet Summit, learn about Alphawave Semi’s new AlphaCHIP1600-IO, an industry-first multi-protocol IO chiplet supporting PCIe Gen 6, CXL 3.1, and 800G Ethernet.
Unlocking the Future of Chiplet Innovation
Discover how OCP’s Open Chiplet Economy is setting hardware and software standards to drive chiplet innovation, enabling scalable, modular solutions for AI and HPC growth.
Synopsys’ Multi-Die Technology Enhances Chiplet Capabilities
In this video from Chiplet Summit, Shekhar Kapoor discusses how Synopsys’ transition to a multi-die approach to chiplet development has allowed them to innovate beyond the limitations of traditional monolithic chips.
Arm Defines a New Standard for Chiplet Interoperability
In this video, learn why Arm is investing in chiplets as a way to build dynamic options for compute in the AI era, and hear more about their new Chiplet Standard Architecture Specification.
3 Key Takeaways from Chiplet Summit 2025
Global tech leaders reveal how chiplet-based architectures, advanced packaging, and industry collaboration are reshaping AI scaling, semiconductor design, and the future of computing.
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