
Chiplet Summit 2025 will be held from January 21-23, 2025, in Santa Clara, California. This event is focused on the rapidly evolving chiplet technology that is transforming semiconductor design. Attendees will explore advancements in chiplet-based architectures, packaging, and interconnect solutions through keynote speeches, technical sessions, and exhibitions. The summit is tailored for engineers, designers, and business leaders in AI, data centers, and consumer electronics, providing insights into improving scalability and time-to-market for next-generation chips. It’s an essential event for anyone involved in driving semiconductor innovation and efficiency.
As AI inference, edge, and autonomous systems outpace legacy networks, this playbook shows how to combine fiber, RF, FSO, and satellite to tame digital asymmetry and build resilient AI connectivity.
Inside Equinix and Solidigm’s playbook for turning data centers into adaptive, AI-ready platforms that balance sovereignty, performance, efficiency, and sustainability across hybrid multicloud.
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
In this video from Chiplet Summit, learn about Alphawave Semi’s new AlphaCHIP1600-IO, an industry-first multi-protocol IO chiplet supporting PCIe Gen 6, CXL 3.1, and 800G Ethernet.
Discover how OCP’s Open Chiplet Economy is setting hardware and software standards to drive chiplet innovation, enabling scalable, modular solutions for AI and HPC growth.
In this video from Chiplet Summit, Shekhar Kapoor discusses how Synopsys’ transition to a multi-die approach to chiplet development has allowed them to innovate beyond the limitations of traditional monolithic chips.
In this video, learn why Arm is investing in chiplets as a way to build dynamic options for compute in the AI era, and hear more about their new Chiplet Standard Architecture Specification.
Global tech leaders reveal how chiplet-based architectures, advanced packaging, and industry collaboration are reshaping AI scaling, semiconductor design, and the future of computing.
AWS re:Invent 2025 is a global cloud computing conference, uniting developers, engineers, and business leaders across multiple Las Vegas venues. Over five days, attendees can engage with visionary keynotes, choose from 2,000+ technical sessions covering infrastructure, AI/ML, security, and DevOps, and participate in hands-on labs and certification prep. The expansive Expo Hall showcases the latest AWS services and partner solutions, while networking receptions and community-driven events foster connections with peers and AWS experts. Whether you’re accelerating your cloud journey, mastering new skills, or exploring generative AI, re:Invent equips you with strategies to innovate and scale