These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
From circularity to U.S. assembly, Giga Computing lays out a rack-scale roadmap tuned for the next phase of AI—where inference drives scale and regional supply chains become a competitive edge.
In Part 2 of Matty Bakkeren’s 2026 predictions series, he explores how regulation, sovereignty, and public trust will push data centers to behave more like utilities than tech projects.
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
From WEKA’s memory grid and exabyte storage to 800G fabrics, liquid-cooled AI factories, edge clusters, and emerging quantum accelerators, SC25 proved HPC is now about end-to-end AI infrastructure.
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
From circularity to U.S. assembly, Giga Computing lays out a rack-scale roadmap tuned for the next phase of AI—where inference drives scale and regional supply chains become a competitive edge.
In Part 2 of Matty Bakkeren’s 2026 predictions series, he explores how regulation, sovereignty, and public trust will push data centers to behave more like utilities than tech projects.
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
From WEKA’s memory grid and exabyte storage to 800G fabrics, liquid-cooled AI factories, edge clusters, and emerging quantum accelerators, SC25 proved HPC is now about end-to-end AI infrastructure.
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
Allyson Klein hosts Manu Fontaine (Hushmesh) and Jason Rogers (Invary) to unpack TEEs, attestation, and how confidential computing is moving from pilots to real deployments across data center and edge.
Allyson Klein and Jeniece Wnorowski welcome Mohan Potheri of Hypertec to explore how immersion cooling slashes energy use, shrinks data-center footprints, and powers sustainable, high-density AI, HPC, and edge solutions on this Data Insights episode.
SayTEC redefines IT with a zero trust, hyper-converged platform delivering sovereign cloud, seamless scalability, and military-grade security for critical industries.
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
In this In the Arena episode, Winbond’s Jun Kawaguchi discusses their industry-leading strategies for tackling next-gen cybersecurity threats, ensuring robust protection for the future.
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
TechArena host Allyson Klein chats with HPE’s Jean-Marie Verdun about his organization’s groundbreaking work to redefine firmware management using OpenBMC technology and how this breakthrough addresses data center customer demands.
TechArena host Allyson Klein chats with CircleB’s Matty Bakkeren about how his organization is leveraging OCP specifications to deliver innovative and sustainable solutions to data center customers, how AI is re-shaping operator requirements, and how he sees the market shaping in 2024.
TechArena hosts Allyson Klein and Jeniece Wronowski chat with CoreWeave’s Jacob Yundt about how his organization is delivering a scalable data pipeline to AI customers utilizing breakthrough VAST Data solutions featuring Solidigm QLC SSDs.
The TechArena kicks off a Data Insights Series in collaboration with Solidigm, and TechArena host welcomes co-host Jeniece Wronowski and Solidigm data center marketing director Ace Stryker to the program to talk about data in the AI era, the series objectives, and how SSD innovation sits at the foundation of a new data pipeline.
TechArena host Allyson Klein chats with OCP’s Cliff Grossner regarding the chiplet era, how architectural evolution has evolved to a chiplet economy, and how the OCP is helping create an open marketplace for innovation.
TechArena host Allyson Klein chats with Voltron Data CEO Josh Patterson about delivery of Theseus, a composable data system framework that unleashes develops with new interoperability and flexibility for AI era data challenges.