Data Center
articles
AI Is Squeezing Storage Supply—and VAST Wants Your Flash
AI demand is tightening HDD and NAND supply—and prices may follow. VAST is betting on flash reclamation and KV-cache persistence as storage starts acting more like memory.
RackRenew Turns Decommissioned OCP Hardware into Ready Capacity
RackRenew remanufactures OCP compliant-infrastructure into certified, warranty-backed assemblies—standardized, tested, and ready to deploy for faster capacity without bespoke engineering.
5 Data Infrastructure Shifts That Will Define Enterprise AI in 2026
These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
OCP 2025: Arm’s Chiplet Play Aims To Democratize AI Compute
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Achieving HPC Performance with Xeon 6 Processors
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
AI Is Squeezing Storage Supply—and VAST Wants Your Flash
AI demand is tightening HDD and NAND supply—and prices may follow. VAST is betting on flash reclamation and KV-cache persistence as storage starts acting more like memory.
RackRenew Turns Decommissioned OCP Hardware into Ready Capacity
RackRenew remanufactures OCP compliant-infrastructure into certified, warranty-backed assemblies—standardized, tested, and ready to deploy for faster capacity without bespoke engineering.
5 Data Infrastructure Shifts That Will Define Enterprise AI in 2026
These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
OCP 2025: Arm’s Chiplet Play Aims To Democratize AI Compute
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Achieving HPC Performance with Xeon 6 Processors
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
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Podcasts
JetCool's Innovative Liquid Cooling Tech Powers High-Performance AI
JetCool Founder & CEO Bernie Malouin discusses the company’s breakthrough liquid cooling tech, which targets processor hotspots with jets of coolant to boost efficiency across intensive workloads.
CoolIT: Revolutionizing Data Centers with Liquid Cooling Tech
Learn how CoolIT Systems is driving efficiency and performance in AI and data centers with cutting-edge liquid cooling solutions in our latest Data Insights podcast.
GEICO’s Rebecca Weekly on IT Transformation and OCP Innovation
In this episode, Rebecca Weekly shares how GEICO is rethinking cloud strategy and embracing OCP for improved efficiency, security, and cost savings in its infrastructure journey.
Data Insights: Arm’s Eddie Ramirez on Data Center Innovations
Join Allyson Klein and Jeniece Wnorowski as they chat with Eddie Ramirez from Arm about how chiplet innovations and compute efficiency are driving AI and transforming data center architecture.
From Desktops to Data Centers: Zane Ball on Silicon Innovation
In this episode – recorded live at the OCP Summit – host Allyson Klein catches up with Intel Corporate VP Zane Ball to discuss silicon innovation, AI evolution, and the future of enterprise adoption.
How Flex Manages Power, Heat and Scale in the AI Era: Part 2
Join us as Rob Campbell from Flex discusses the challenges and innovations in data centers, focusing on power, heat, and scale, while shaping the future of AI and sustainable solutions.
OCP, Power Grids & Open Racks — with Dr. Andrew Chien
From OCP Summit San Jose, Allyson Klein and co-host Jeniece Wnorowski interview Dr. Andrew Chien (UChicago & Argonne) on grid interconnects, rack-scale standards, and how openness speeds innovation.
Ventiva Reinvents Cooling with Silent Airflow Tech
Ventiva CEO Carl Schlachte joins Allyson Klein to share how the company’s Ionic Cooling Engine is transforming laptops, servers, and beyond with silent, modular airflow.
Cracking the Code on Storage Efficiency with Solidigm
Explore myths, metrics, and strategies shaping the future of energy-efficient data centers with Solidigm’s Scott Shadley, from smarter drives to sustainability-ready architectures.
Immersion Cooling: Revolutionizing AI & Edge Computing
Allyson Klein and Jeniece Wnorowski welcome Mohan Potheri of Hypertec to explore how immersion cooling slashes energy use, shrinks data-center footprints, and powers sustainable, high-density AI, HPC, and edge solutions on this Data Insights episode.
SayTEC Powers Scalable, Secure, Sovereign IT Infrastructure
SayTEC redefines IT with a zero trust, hyper-converged platform delivering sovereign cloud, seamless scalability, and military-grade security for critical industries.
Flexibility at the Edge: Pragmatic Semiconductor’s Bold Approach
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
