Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
From WEKA’s memory grid and exabyte storage to 800G fabrics, liquid-cooled AI factories, edge clusters, and emerging quantum accelerators, SC25 proved HPC is now about end-to-end AI infrastructure.
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
On Day 1 of KubeCon + CloudNativeCon Atlanta, CNCF unveiled Kubernetes AI Conformance to make workloads portable—arriving as inference surges to ~1.33 quadrillion tokens/month across Google’s systems.
Multi-year agreement makes VAST AI OS CoreWeave’s primary data foundation, aligning roadmaps for instant dataset access and performance across training and real-time inference in global AI cloud regions.
At the OCP Global Summit, Avayla CEO Kelley Mullick reveals how rapid standardization and hybrid cooling strategies are reshaping infrastructure for the AI era.
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
From WEKA’s memory grid and exabyte storage to 800G fabrics, liquid-cooled AI factories, edge clusters, and emerging quantum accelerators, SC25 proved HPC is now about end-to-end AI infrastructure.
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
On Day 1 of KubeCon + CloudNativeCon Atlanta, CNCF unveiled Kubernetes AI Conformance to make workloads portable—arriving as inference surges to ~1.33 quadrillion tokens/month across Google’s systems.
Multi-year agreement makes VAST AI OS CoreWeave’s primary data foundation, aligning roadmaps for instant dataset access and performance across training and real-time inference in global AI cloud regions.
At the OCP Global Summit, Avayla CEO Kelley Mullick reveals how rapid standardization and hybrid cooling strategies are reshaping infrastructure for the AI era.
From OCP Summit 2025, Kelley Mullick joins Allyson Klein and co-host Jeniece Wnorowski for a Data Insights episode on rack-scale design, hybrid cooling (incl. immersion heat recapture), and open standards.
At OCP’s 2025 global summit, Momenthesis founder Matty Bakkeren joins Allyson Klein to explore why open standards and interoperability are vital to sustaining AI innovation at datacenter scale.
AMI CEO Sanjoy Maity joins In the Arena to unpack the company's shift to open source firmware, OCP contributions, OpenBMC hardening, and the rack-scale future—cooling, power, telemetry, and RAS built for AI.
Graid Technology takes on Intel VROC licensing for data center and workstation customers, extending its RAID portfolio to offer both CPU-integrated and GPU-accelerated solutions.
Ventiva CEO Carl Schlachte joins Allyson Klein to share how the company’s Ionic Cooling Engine is transforming laptops, servers, and beyond with silent, modular airflow.
Discover how JetCool’s proprietary liquid cooling is solving AI’s toughest heat challenges—keeping data centers efficient as workloads and power densities skyrocket.
MIPS CTO Durgesh Srivastava shares insights on AI, data centers, automotive edge, and how MIPS is leveraging RISC-V to drive efficient, flexible computing solutions.
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.