Data Center
articles
Giga Computing: Rack-Scale, Regional, and Ready for Inference
From circularity to U.S. assembly, Giga Computing lays out a rack-scale roadmap tuned for the next phase of AI—where inference drives scale and regional supply chains become a competitive edge.
8 Ways Power, Policy, & Public Trust will Reshape Data Centers
In Part 2 of Matty Bakkeren’s 2026 predictions series, he explores how regulation, sovereignty, and public trust will push data centers to behave more like utilities than tech projects.
OCP 2025: Arm’s Chiplet Play Aims To Democratize AI Compute
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Inside SC25: AI Factories From Racks to Qubits
From WEKA’s memory grid and exabyte storage to 800G fabrics, liquid-cooled AI factories, edge clusters, and emerging quantum accelerators, SC25 proved HPC is now about end-to-end AI infrastructure.
Achieving HPC Performance with Xeon 6 Processors
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
KubeCon Atlanta: CNCF Sets AI Standard for Kubernetes
On Day 1 of KubeCon + CloudNativeCon Atlanta, CNCF unveiled Kubernetes AI Conformance to make workloads portable—arriving as inference surges to ~1.33 quadrillion tokens/month across Google’s systems.
CoolIT: 5 Fast Facts on Compute Efficiency
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
Mark Grodzinsky on Building Ecosystems That Last
From Wi-Fi to AI, Mark Grodzinsky shares how chance turns, mentors, and market inflection points shaped his career – and why true innovation is about impact, not hype.
Compass & Schneider Launch Prefab Pod for AI Data Centers
The new EcoStruxure™ Pod accelerates data center readiness, reducing complexity, cost, and risk while boosting sustainability and AI workload support.
Microsoft’s Tannu Jiwnani on Responsible Innovation & Cybersecurity
From anti–money-laundering analytics to leading identity protection, Tannu Jiwnani shares how curiosity, resilience, and inclusive leadership shape responsible innovation and why diversity is security’s superpower.
Announcing TechArena’s 2025–2026 Voices of Innovation Fellows
Experts from across the compute industry provide their bold views and real-world expertise on AI era computing is driving business and societal opportunity.
5 Fast Facts: Vigilent’s AI for Cooling Plant Optimization
Leading up to Yotta 2025, we discussed compute efficiency with Cliff Federspiel of Vigilent, which is pioneering the use of IoT and AI to deliver dynamic cooling management in mission-critical environments.
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Podcasts
An Open Computing Landscape with OpenUK’s Amanda Brock
TechArena host Allyson Klein chats with OpenUK CEO Amanda Brock live from the OCP Regional Summit in Prague on her organization’s mission to drive open software, hardware and data contributions for UK developers.
The In-Memory Future of Applications with Oracle
TechArena host Allyson Klein chats with Oracle VP Shasank Chavan about in-memory databases, customer demands in a data centric world, and how infrastructure must change to fuel customer needs.
The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi
TechArena host Allyson Klein chats with Alphawave Semi’s Letizia Guiliano about the future of semiconductor innovation across memory, optical and interoperable chiplet solutions and how her company is poised to deliver leadership innovation rooted in standards.
CXL Enabled Memory Innovation with Memverge
TechArena host Allyson Klein chats with Memverge founder and CEO Charles Fan about his company’s disruptive vision for breaking through data center memory limitations and what the CXL standard will bring to infrastructure innovation.
Breakthrough Data Center Platform Innovation with AMD
TechArena host Allyson Klein chats with AMD senior fellow and CXL technical taskforce co-chair Mahesh Wagh regarding AMD’s entry of CXL platforms into the market gen 4 AMD EYPC processors and his organization’s strategy to deliver disruptive innovation utilizing CXL capability in the years ahead.
UCIe Unleashing Chiplet Innovation with NVIDIA
TechArena host Allyson Klein chats with NVIDIA Data Center Product Architect and Universal Chiplet Interconnect Express organization board member Durgesh Srivastava about the new UCIe specification and how it will reshape the foundations of compute architectures.
Nebius at SC25: Building the Neocloud for Enterprise AI
From SC25 in St. Louis, Nebius shares how its neocloud, Token Factory PaaS, and supercomputer-class infrastructure are reshaping AI workloads, enterprise adoption, and efficiency at hyperscale.
Giga Computing on Rack-Scale AI: From Training to Inference
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
RackRenew & Circularity: Remanufacture, Recertify, Redeploy
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
From OCP 2025: Arm’s Chiplet Push and the AI Ecosystem Play
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
