Matty Bakkeren checks in on how data center trends are playing out in 2025, from nations pouring billions into AI supremacy projects to how data centers are trying to offset massive energy needs.
New integration delivers enterprise-grade backup, disaster recovery, and cyber resilience for virtualized and container-based workloads across Platform9’s Private Cloud Director.
From childhood gaming consoles to guiding Intel’s message to market, Allyson Klein has spent decades proving that the best tech stories happen when engineers feel invited to share what they’ve created.
At Cloud Field Day 23, Qumulo showcased its cloud data fabric, unifying hybrid environments and solving real-world challenges in media, pharma, public safety, and more with strict data consistency.
A solution from HPE and SAP aims to simplify SAP Cloud ERP adoption with managed private cloud, ecosystem integration, and AI agents for enterprise transformation.
At Cloud Field Day 23, Scality highlighted real-world deployments that tackle petabyte-scale challenges with resilience, flexibility, and customer-driven innovation.
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
From Wi-Fi to AI, Mark Grodzinsky shares how chance turns, mentors, and market inflection points shaped his career – and why true innovation is about impact, not hype.
The new EcoStruxure™ Pod accelerates data center readiness, reducing complexity, cost, and risk while boosting sustainability and AI workload support.
From anti–money-laundering analytics to leading identity protection, Tannu Jiwnani shares how curiosity, resilience, and inclusive leadership shape responsible innovation and why diversity is security’s superpower.
Experts from across the compute industry provide their bold views and real-world expertise on AI era computing is driving business and societal opportunity.
Leading up to Yotta 2025, we discussed compute efficiency with Cliff Federspiel of Vigilent, which is pioneering the use of IoT and AI to deliver dynamic cooling management in mission-critical environments.
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Recorded at #OCPSummit25, Allyson Klein and Jeniece Wnorowski sit down with Giga Computing’s Chen Lee to unpack GIGAPOD and GPM, DLC/immersion cooling, regional assembly, and the pivot to inference.
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Allyson Klein and co-host Jeniece Wnorowski sit down with Arm’s Eddie Ramirez to unpack Arm Total Design’s growth, the FCSA chiplet spec contribution to OCP, a new board seat, and how storage fits AI’s surge.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.