From manure-to-energy RNG to an aluminum-air system that generates electricity on demand, innovators tackled real AI bottlenecks—power-chain integration, rapid fiber turn-ups, AI-driven permitting, and plug-and-play capacity that speeds time-to-value.
AMD improved energy efficiency 38x—roughly a 97% drop in energy for the same compute—and now targets 20x rack-scale gains by 2030, reimagining AI training, inference, and data-center design.
Exploring how Flex is rethinking data center power and cooling – from 97.5% efficient power shelves to liquid cooling and “grid to chip” solutions – with Chris Butler, President of Embedded & Critical Power.
Vanguard lead data engineer and IEEE senior member Vivek Venkatesan shares how a pivotal Botswana project shaped his path, how trust turns innovation into impact , and much more.
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
From Wi-Fi to AI, Mark Grodzinsky shares how chance turns, mentors, and market inflection points shaped his career – and why true innovation is about impact, not hype.
From childhood gaming consoles to guiding Intel’s message to market, Allyson Klein has spent decades proving that the best tech stories happen when engineers feel invited to share what they’ve created.
At Cloud Field Day 23, Qumulo showcased its cloud data fabric, unifying hybrid environments and solving real-world challenges in media, pharma, public safety, and more with strict data consistency.
A solution from HPE and SAP aims to simplify SAP Cloud ERP adoption with managed private cloud, ecosystem integration, and AI agents for enterprise transformation.
At Cloud Field Day 23, Scality highlighted real-world deployments that tackle petabyte-scale challenges with resilience, flexibility, and customer-driven innovation.
As AI drives explosive data growth, next-gen SSDs deliver the speed, density, and efficiency to outpace HDDs—reshaping storage strategy for tomorrow’s data-centric data centers.
The Common Vulnerabilities and Exposures (CVE) landscape is shifting—governance is changing, and security pros are moving beyond raw CVE counts to focus on context-aware, risk-based vulnerability management.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.