From manure-to-energy RNG to an aluminum-air system that generates electricity on demand, innovators tackled real AI bottlenecks—power-chain integration, rapid fiber turn-ups, AI-driven permitting, and plug-and-play capacity that speeds time-to-value.
AMD improved energy efficiency 38x—roughly a 97% drop in energy for the same compute—and now targets 20x rack-scale gains by 2030, reimagining AI training, inference, and data-center design.
Exploring how Flex is rethinking data center power and cooling – from 97.5% efficient power shelves to liquid cooling and “grid to chip” solutions – with Chris Butler, President of Embedded & Critical Power.
Vanguard lead data engineer and IEEE senior member Vivek Venkatesan shares how a pivotal Botswana project shaped his path, how trust turns innovation into impact , and much more.
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
From Wi-Fi to AI, Mark Grodzinsky shares how chance turns, mentors, and market inflection points shaped his career – and why true innovation is about impact, not hype.
A 2025 field guide for architects: why Arm’s software gravity and hyperscaler adoption make it the low-friction path today, where RISC-V is gaining ground, and the curveballs that could reshape both.
The cloud security architect who came from networking explains her framework for separating tech hype from genuine innovation, and why stepping away is key to solving hard problems.
Industry leaders reveal why data-centric, change-ready data center architectures will determine who thrives in the age of unpredictable AI advancements.
Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.
Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.
Appointment to Open Compute Project Foundation board of directors, contribution of Foundation Chiplet System Architecture (FCSA) spec underscore Arm’s ascendency in hyperscale, AI data centers.
TechArena host Allyson Klein chats with OCP’s Cliff Grossner regarding the chiplet era, how architectural evolution has evolved to a chiplet economy, and how the OCP is helping create an open marketplace for innovation.
TechArena host Allyson Klein chats with Voltron Data CEO Josh Patterson about delivery of Theseus, a composable data system framework that unleashes develops with new interoperability and flexibility for AI era data challenges.
TechArena host Allyson Klein chats with Ampere Chief Product Officer Jeff Wittich about his company’s progress in winning data center deployments, advances in performance and sustainability, and pushing the limits on core density.
TechArena host Allyson Klein chats with Fortinet security experts Srija Allam and Julian Petersohn about the expansive Fortinet solution portfolio and how the company is leaning into AI to help deliver the protection customers require.
TechArena host Allyson Klein sits down with the marketing co-chairs of the CXL Consortium at SC’23 to discuss the introduction of the new 3.1 spec, the emergence of true CXL 2.0 solutions, and what comes next from this disruptive standard that will re-define data center infrastructure.
TechArena host Allyson Klein sat down with AMD’s Robert Hormuth and Prabhu Jayanna at the Open Compute Summit to discuss the advancements AMD EPYC processors have delivered in performance, performance efficiency and security capability including AMD’s Infinity Guard technology.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.