CelLink’s ultrathin flex harnessing ushers in a new era in compute infrastructure innovation, cutting cable volume by up to 90% and boosting density, reliability, and efficiency.
As AI workloads push storage power consumption higher, the path to true storage efficiency demands systems-level thinking including hardware, software, and better metrics for picking the right drives.
Dave Driggers, CEO of Cirrascale, breaks down what “compute efficiency” really means, from GPU utilization and TCO modeling to token-based pricing that drives predictable customer value.
From data center to edge, Arm is enabling full-stack AI efficiency, powering ecosystems with performance-per-watt optimization, tailored silicon, and software portability across environments.
Real-Time Energy Routing (RER) treats electricity like data—modular, dynamic, and software-defined—offering a scalable path to resilient, sustainable data center power.
Intel shares insights on Arm vs. x86 efficiency, energy goals for 2030, AI-driven power demands, and how enterprises can navigate compute efficiency in the AI era.
A 2025 field guide for architects: why Arm’s software gravity and hyperscaler adoption make it the low-friction path today, where RISC-V is gaining ground, and the curveballs that could reshape both.
The cloud security architect who came from networking explains her framework for separating tech hype from genuine innovation, and why stepping away is key to solving hard problems.
Industry leaders reveal why data-centric, change-ready data center architectures will determine who thrives in the age of unpredictable AI advancements.
Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.
Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.
Appointment to Open Compute Project Foundation board of directors, contribution of Foundation Chiplet System Architecture (FCSA) spec underscore Arm’s ascendency in hyperscale, AI data centers.
TechArena host Allyson Klein chats with Arm’s Eddie Ramirez at the Open Compute Summit about the architecture’s progress in data center, growing a thriving ecosystem, and the sustainability advantages of Arm’s design making it even more attractive to data center operators.
TechArena host Allyson Klein chats with Solidigm’s Roger Corell and Tahmid Rahman at the OCP Summit about their company’s heritage in the storage arena and how their SSD portfolio delivers the performance and efficiency required for the AI era.
TechArena host Allyson Klein chats with Cloudflare VP Rebecca Weekly at the OCP Summit on far ranging topics including the demands of AI on infrastructure, how Summit announcements will shape the industry, and the importance of modular and circular infrastructure oversight.
TechArena' host Allyson Klein chats with Oracle executive Bev Crair on how she’s tackling long term strategic planning for OCI to get ahead of where the market and customers travel and how this approach informs Oracle business.
TechArena host Allyson Klein chats with HED associate principal Sara Martin about the trends in greenfield data center buildout and what drives determination of greenfield site prioritization.
TechArena host Allyson Klein chats with Alphawave Semi’s CTO Tony Chan Carusone regarding the unique opportunity for connectivity innovation to fuel the era of AI and why Alphawave is perfectly poised for IP, chiplet and custom solution delivery.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.