Data Center
articles
The Connectivity Broker for the AI Era: AlphaWave Semi
TechArena’s take on the importance of connectivity to AI and how Alphawave Semi is poised to deliver the perfect portfolio for solution activation.
The Future of VMware: Going Down the Rabbit Hole at VMware Explore 2023
Allyson Klein goes down the rabbit hole of Broadcom’s pending acquisition of VMWare and posits that NSX may be the jewel of the VMWare portfolio.
The Future of Silicon Innovation in the Chiplet Era
TechArena’s take on Alphawave Semi and how Letizia Guiliano and her team are poised to win in the chiplet era
MemCon and the Path Forward with Memory in a Post Moore’s Law World
TechArena’s take on the path to memory innovation from MemCon
Intel Showcases IT Strengths with Sapphire Rapids Delivery
TechArena’s take on Intel’s 4th Generation Xeon Processor launch (aka the arrival of Sapphire Rapids).
The TechArena Cloud 2023
TechArena Cloud 2023 delivers seven strategies for maximizing organizational return based on industry expert perspectives.
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Podcasts
RackRenew & Circularity: Remanufacture, Recertify, Redeploy
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
Hybrid Quantum + HPC: CESQ’s Lesya Dymyd at OCP 2025
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
OCP, Power Grids & Open Racks — with Dr. Andrew Chien
From OCP Summit San Jose, Allyson Klein and co-host Jeniece Wnorowski interview Dr. Andrew Chien (UChicago & Argonne) on grid interconnects, rack-scale standards, and how openness speeds innovation.
Ventiva Reinvents Cooling with Silent Airflow Tech
Ventiva CEO Carl Schlachte joins Allyson Klein to share how the company’s Ionic Cooling Engine is transforming laptops, servers, and beyond with silent, modular airflow.
RackRenew & Circularity: Remanufacture, Recertify, Redeploy
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
Hybrid Quantum + HPC: CESQ’s Lesya Dymyd at OCP 2025
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
OCP, Power Grids & Open Racks — with Dr. Andrew Chien
From OCP Summit San Jose, Allyson Klein and co-host Jeniece Wnorowski interview Dr. Andrew Chien (UChicago & Argonne) on grid interconnects, rack-scale standards, and how openness speeds innovation.
Ventiva Reinvents Cooling with Silent Airflow Tech
Ventiva CEO Carl Schlachte joins Allyson Klein to share how the company’s Ionic Cooling Engine is transforming laptops, servers, and beyond with silent, modular airflow.
