Data Center
Highlights
How Equinix & Solidigm See Evolving Workloads Reshaping IT
Industry leaders reveal why data-centric, change-ready data center architectures will determine who thrives in the age of unpredictable AI advancements.
From Box to Building—How Open Compute Is Rewiring the AI Factory
Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.
OCP 2025: Open is the Only Way We Scale the AI Data Center
Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.
Arm Joins OCP Board, Contributes Chiplet Architecture Spec
Appointment to Open Compute Project Foundation board of directors, contribution of Foundation Chiplet System Architecture (FCSA) spec underscore Arm’s ascendency in hyperscale, AI data centers.
CelLink Flex Harnesses Enable the AI Power Revolution
CelLink’s ultrathin flex harnessing ushers in a new era in compute infrastructure innovation, cutting cable volume by up to 90% and boosting density, reliability, and efficiency.
Giving Storage Strategy a Reboot for Efficiency with Solidigm
As AI workloads push storage power consumption higher, the path to true storage efficiency demands systems-level thinking including hardware, software, and better metrics for picking the right drives.
Cirrascale CEO on Defining Compute Efficiency
Dave Driggers, CEO of Cirrascale, breaks down what “compute efficiency” really means, from GPU utilization and TCO modeling to token-based pricing that drives predictable customer value.
5 Fast Facts: Arm’s Role in Shaping AI Infrastructure
From data center to edge, Arm is enabling full-stack AI efficiency, powering ecosystems with performance-per-watt optimization, tailored silicon, and software portability across environments.
Nlevel Rethinks Power: What If Energy Worked Like the Internet?
Real-Time Energy Routing (RER) treats electricity like data—modular, dynamic, and software-defined—offering a scalable path to resilient, sustainable data center power.
Intel on Compute Efficiency and the Future of AI Data Centers
Intel shares insights on Arm vs. x86 efficiency, energy goals for 2030, AI-driven power demands, and how enterprises can navigate compute efficiency in the AI era.
Inside Yotta’s Innovate Arena: Standout Breakthroughs for AI
From manure-to-energy RNG to an aluminum-air system that generates electricity on demand, innovators tackled real AI bottlenecks—power-chain integration, rapid fiber turn-ups, AI-driven permitting, and plug-and-play capacity that speeds time-to-value.
AMD’s 38x Efficiency Leap Sets Stage for Ambitious 2030 Goal
AMD improved energy efficiency 38x—roughly a 97% drop in energy for the same compute—and now targets 20x rack-scale gains by 2030, reimagining AI training, inference, and data-center design.
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Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
PEAK:AIO on Smarter Storage for AI—Data Insights @ OCP
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
CelLink PowerPlane: Flat Power for AI Server Racks
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Hybrid Quantum + HPC: CESQ’s Lesya Dymyd at OCP 2025
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
Ventiva Brings Innovative Solid-State Cooling to the AI Data Center
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.
JetCool's Innovative Liquid Cooling Tech Powers High-Performance AI
JetCool Founder & CEO Bernie Malouin discusses the company’s breakthrough liquid cooling tech, which targets processor hotspots with jets of coolant to boost efficiency across intensive workloads.
CoolIT: Revolutionizing Data Centers with Liquid Cooling Tech
Learn how CoolIT Systems is driving efficiency and performance in AI and data centers with cutting-edge liquid cooling solutions in our latest Data Insights podcast.
GEICO’s Rebecca Weekly on IT Transformation and OCP Innovation
In this episode, Rebecca Weekly shares how GEICO is rethinking cloud strategy and embracing OCP for improved efficiency, security, and cost savings in its infrastructure journey.
Data Insights: Arm’s Eddie Ramirez on Data Center Innovations
Join Allyson Klein and Jeniece Wnorowski as they chat with Eddie Ramirez from Arm about how chiplet innovations and compute efficiency are driving AI and transforming data center architecture.
From Desktops to Data Centers: Zane Ball on Silicon Innovation
In this episode – recorded live at the OCP Summit – host Allyson Klein catches up with Intel Corporate VP Zane Ball to discuss silicon innovation, AI evolution, and the future of enterprise adoption.
How Flex Manages Power, Heat and Scale in the AI Era: Part 2
Join us as Rob Campbell from Flex discusses the challenges and innovations in data centers, focusing on power, heat, and scale, while shaping the future of AI and sustainable solutions.
