Data Center
Highlights
Srija Reddy Allam: Innovation Is Progress Over Perfection
The cloud security architect who came from networking explains her framework for separating tech hype from genuine innovation, and why stepping away is key to solving hard problems.
How Equinix & Solidigm See Evolving Workloads Reshaping IT
Industry leaders reveal why data-centric, change-ready data center architectures will determine who thrives in the age of unpredictable AI advancements.
From Box to Building—How Open Compute Is Rewiring the AI Factory
Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.
OCP 2025: Open is the Only Way We Scale the AI Data Center
Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.
Arm Joins OCP Board, Contributes Chiplet Architecture Spec
Appointment to Open Compute Project Foundation board of directors, contribution of Foundation Chiplet System Architecture (FCSA) spec underscore Arm’s ascendency in hyperscale, AI data centers.
CelLink Flex Harnesses Enable the AI Power Revolution
CelLink’s ultrathin flex harnessing ushers in a new era in compute infrastructure innovation, cutting cable volume by up to 90% and boosting density, reliability, and efficiency.
Srija Reddy Allam: Innovation Is Progress Over Perfection
The cloud security architect who came from networking explains her framework for separating tech hype from genuine innovation, and why stepping away is key to solving hard problems.
How Equinix & Solidigm See Evolving Workloads Reshaping IT
Industry leaders reveal why data-centric, change-ready data center architectures will determine who thrives in the age of unpredictable AI advancements.
From Box to Building—How Open Compute Is Rewiring the AI Factory
Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.
OCP 2025: Open is the Only Way We Scale the AI Data Center
Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.
Arm Joins OCP Board, Contributes Chiplet Architecture Spec
Appointment to Open Compute Project Foundation board of directors, contribution of Foundation Chiplet System Architecture (FCSA) spec underscore Arm’s ascendency in hyperscale, AI data centers.
CelLink Flex Harnesses Enable the AI Power Revolution
CelLink’s ultrathin flex harnessing ushers in a new era in compute infrastructure innovation, cutting cable volume by up to 90% and boosting density, reliability, and efficiency.
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Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Driving Sustainable Data Center Infrastructure for the Next Wave of Greenfield Buildout with Jon Summers
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
Disruptive Chiplet Innovation Delivers the Next Wave of Data Center Performance with Palo Alto Electron’s Jawad Nasrullah
TechArena host Allyson Klein chats with Palo Alto Electron CEO Jawad Nasrullah about his vision for an open chiplet economy, the semiconductor manufacturing hurdles standing in the way of broad chiplet market delivery, and how he plans to play a role in shaping this next evolution of the semiconductor landscape.
Accelerating European Data Center Buildout with OCP’s Raul Alvarez
TechArena host Allyson Klein chats with OCP’s Raul Alvarez on his new charter accelerating growth of the data center market in Europe as well as his ongoing work in immersion cooling technologies from OCP Lisbon 2024.
Immersion, Not Hype: Midas on Liquid Cooling at OCP
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
Castrol on Liquid Cooling: Additives, Filters, Failure Modes
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
PEAK:AIO on Smarter Storage for AI—Data Insights @ OCP
From OCP San Jose, PEAK:AIO’s Roger Cummings explains how workload-aware file systems, richer memory tiers, and capturing intelligence at the edge reduce cost and complexity.
CelLink PowerPlane: Flat Power for AI Server Racks
Innovative power delivery unlocks a shift in data-center design. CelLink PowerPlane routes thousands of amps in a flat, flexible circuit—cutting cabling and accelerating AI factory builds.
Hybrid Quantum + HPC: CESQ’s Lesya Dymyd at OCP 2025
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.
Ventiva Brings Innovative Solid-State Cooling to the AI Data Center
CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.
