Data center industry veteran Lynn Comp shares insights from her career, discussing the importance of adaptability, emotional IQ, and practical tech. She highlights three patterns: customers prefer reliability over high-performance solutions, network limitations can negate compute power, and economic realities can override technological enthusiasm.
The upcoming OCP Summit in October will feature nineteen top-tier sponsors, up from just three in previous years, highlighting OCP’s role in AI infrastructure innovation. TechArena is excited to be a media sponsor, covering sustainable infrastructure, Sonic’s future, memory advancements, and power and cooling solutions with daily podcasts, video interviews, and stories.
In this blog post, industry veteran Jim Fister explores the evolution of data centers from early 2000s servers to modern AI/ML racks. Highlighting engineering and logistical challenges, he emphasizes the need for ongoing innovation and celebrates engineers while anticipating future advancements to meet increasing power demands.
TechArena spoke to over a dozen industry experts from OVH, Qarnot, PLVision, ZeroPoint Technologies, the Research Institutes of Sweden, London South Bank University, and the Open Compute Project to publish this comprehensive report on the state of open compute infrastructure innovation and how organizations should align data center planning and oversight with sustainability and performance objectives. If you manage an IT organization or oversee data center infrastructure, software, or sustainability initiatives, this report offers practical value for your organization.
TechArena’s take on Microsoft Build announcement of the world’s first MI300X instances arriving on Azure AI.
TechArena’s take on a recent Data Insights conversation featuring Supermicro and Solidigm on how Supermicro’s solutions are targeting AI data pipeline requirements and the role SSDs play in delivering high performance, efficiency and density for Supermicro solutions.
Data center industry veteran Lynn Comp shares insights from her career, discussing the importance of adaptability, emotional IQ, and practical tech. She highlights three patterns: customers prefer reliability over high-performance solutions, network limitations can negate compute power, and economic realities can override technological enthusiasm.
The upcoming OCP Summit in October will feature nineteen top-tier sponsors, up from just three in previous years, highlighting OCP’s role in AI infrastructure innovation. TechArena is excited to be a media sponsor, covering sustainable infrastructure, Sonic’s future, memory advancements, and power and cooling solutions with daily podcasts, video interviews, and stories.
In this blog post, industry veteran Jim Fister explores the evolution of data centers from early 2000s servers to modern AI/ML racks. Highlighting engineering and logistical challenges, he emphasizes the need for ongoing innovation and celebrates engineers while anticipating future advancements to meet increasing power demands.
TechArena spoke to over a dozen industry experts from OVH, Qarnot, PLVision, ZeroPoint Technologies, the Research Institutes of Sweden, London South Bank University, and the Open Compute Project to publish this comprehensive report on the state of open compute infrastructure innovation and how organizations should align data center planning and oversight with sustainability and performance objectives. If you manage an IT organization or oversee data center infrastructure, software, or sustainability initiatives, this report offers practical value for your organization.
TechArena’s take on Microsoft Build announcement of the world’s first MI300X instances arriving on Azure AI.
TechArena’s take on a recent Data Insights conversation featuring Supermicro and Solidigm on how Supermicro’s solutions are targeting AI data pipeline requirements and the role SSDs play in delivering high performance, efficiency and density for Supermicro solutions.
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
In this podcast, NCSA Director Bill Gropp explores the latest advanced computing trends, from AI innovations to groundbreaking research on supercomputing climate models, and how this tech is transforming science and society.
Discover how AI is transforming data centers, with innovations in high-speed networking, emulation, and hyperscale infrastructure driving efficiency and performance in the era of AI workloads.
OCP’s Rob Coyle shares insights on AI, cooling innovations, and open hardware’s role in transforming data centers as the industry accelerates toward scalable, sustainable infrastructure.
In this episode, OCP CEO George Tchaparian shares how OCP is driving AI infrastructure innovation, fostering collaboration, and tackling scalability, efficiency, and sustainability challenges in data centers and beyond.
JetCool Founder & CEO Bernie Malouin discusses the company’s breakthrough liquid cooling tech, which targets processor hotspots with jets of coolant to boost efficiency across intensive workloads.
Tune in as Jason Maselino of Circle B discusses the role of Open Compute Project in revolutionizing data centers with energy-efficient solutions, modular designs, and AI-ready infrastructure.
MIPS CTO Durgesh Srivastava shares insights on AI, data centers, automotive edge, and how MIPS is leveraging RISC-V to drive efficient, flexible computing solutions.
Tod Higinbotham, COO of ZincFive, discusses the role of nickel-zinc batteries in supporting AI workloads, improving data center efficiency, and advancing sustainability in power infrastructure.
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.