Synopsys Accelerates Chip Design with NVIDIA Grace Blackwell, AI
At GTC today, Synopsys delivered a unique insight into the reach of Grace Blackwell-powered innovation with the release a suite of electronic design automation (EDA) tools including PrimeSim circuit simulation, Proteus computational lithography simulation, and Synopsys AI CoPilot. PrimeSim taps NVIDIA CUDA-X libraries to help accelerate circuit design by up to 30x vs historic solutions. Proteus advancement is not that far behind, achieving up to 20x performance improvement within the lithography arena. That collective performance advancement is simply stunning, especially when considering the incredible pressure on the semiconductor industry to innovate and deliver bespoke solutions that are optimized for point workload requirements across the AI continuum and across cloud-to-edge environments.
This announcement is reflective of the increased complexity of semiconductor design and delivery in the AI era, something we covered extensively on the TechArena platform at Chiplet Summit earlier this year, as monolithic designs shift to more complex packaging technologies enabling modular chiplets, often delivered across different process technologies.
We'll be spending time with Synopsys later today and tomorrow to learn more about this and other advancements from the tech leader as they continue advancing foundational technology to fuel the next generation of semiconductor innovation.
At GTC today, Synopsys delivered a unique insight into the reach of Grace Blackwell-powered innovation with the release a suite of electronic design automation (EDA) tools including PrimeSim circuit simulation, Proteus computational lithography simulation, and Synopsys AI CoPilot. PrimeSim taps NVIDIA CUDA-X libraries to help accelerate circuit design by up to 30x vs historic solutions. Proteus advancement is not that far behind, achieving up to 20x performance improvement within the lithography arena. That collective performance advancement is simply stunning, especially when considering the incredible pressure on the semiconductor industry to innovate and deliver bespoke solutions that are optimized for point workload requirements across the AI continuum and across cloud-to-edge environments.
This announcement is reflective of the increased complexity of semiconductor design and delivery in the AI era, something we covered extensively on the TechArena platform at Chiplet Summit earlier this year, as monolithic designs shift to more complex packaging technologies enabling modular chiplets, often delivered across different process technologies.
We'll be spending time with Synopsys later today and tomorrow to learn more about this and other advancements from the tech leader as they continue advancing foundational technology to fuel the next generation of semiconductor innovation.
